SCHEMBL10098930

SCHEMBL10098930

CCc1ccc(N2C(=O)c3ccc(C(=O)NC)cc3C2=O)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PLK1 P53350 1/20 0.56
▸ ALDH1A1 P00352 3/20 0.51
▸ MEN1 O00255 5/20 0.51
▸ KMT2A Q03164 5/20 0.51
▸ CA12 O43570 5/20 0.51
▸ CA4 P22748 4/20 0.51
▸ CA7 P43166 2/20 0.51
▸ CA1 P00915 5/20 0.50
▸ CA9 Q16790 5/20 0.50
▸ CA2 P00918 4/20 0.50
▸ DNM2 P50570 1/20 0.49
▸ RAB9A P51151 1/20 0.49
▸ HTT P42858 1/20 0.48
▸ GFER P55789 1/20 0.48
▸ POLB P06746 2/20 0.48
▸ KDM4E B2RXH2 1/20 0.48
▸ CYP1A2 P05177 1/20 0.48
▸ HPGD P15428 1/20 0.48
▸ CYP2C19 P33261 1/20 0.48
▸ TDP1 Q9NUW8 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1696020 0.88 CA9 (0.58) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL13155491 0.86 CA9 (0.65) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL10098943 0.83 CA12 (0.64) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL10098928 0.83 CA9 (0.60) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL13012943 0.81 MEN1 (0.47) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL12405518 0.80 NPSR1 (0.73) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL16088590 0.80 CA9 (0.68) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL4570499 0.80 MMP13 (0.61) ALDH1A1MEN1KMT2ACA12CA1
SCHEMBL13012939 0.78 MEN1 (0.51) ALDH1A1MEN1KMT2ACA12CA4
SCHEMBL15397059 0.77 NPSR1 (0.57) ALDH1A1MEN1KMT2ACA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8470913-B2 Thermosetting resin composition and cured product of the same DIC CORPORATION (JP) 2013-06-25 — — US disclosed
US-20120142829-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME DIC CORPORATION (JP) 2012-06-07 — — US disclosed
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