SCHEMBL101107

SCHEMBL101107

CC1(C)CC(NC(=O)N(CCO)CCCO)CC(C)(CNC(=O)N(CCO)CCO)C1

nearest known ligand 0.50

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.50
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25477747 0.87 TSHR (0.51) TSHRTDP1
SCHEMBL19655693 0.87 TSHR (0.51) TSHRTDP1
SCHEMBL19655692 0.83 TSHR (0.47) TSHRTDP1
SCHEMBL17346759 0.82 TSHR (0.57) TSHRTDP1
SCHEMBL17552040 0.81 TSHR (0.50) TSHRTDP1
SCHEMBL11015285 0.81 TSHR (0.52) TSHRTDP1
SCHEMBL17552042 0.78 TSHR (0.52) TSHRTDP1
SCHEMBL17758691 0.77 TSHR (0.46) TSHRTDP1
SCHEMBL3837629 0.77 TSHR (0.59) TSHRTDP1
SCHEMBL14964832 0.77 TSHR (0.59) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9475904-B2 Heat curable epoxy resin composition with water as foaming agent SIKA TECHNOLOGY AG (CH) 2016-10-25 US disclosed
US-9475904-B2 Heat curable epoxy resin composition with water as foaming agent SIKA TECHNOLOGY AG (CH) 2016-10-25 US disclosed
US-20120055631-A1 HEAT CURABLE EPOXY RESIN COMPOSITION WITH WATER AS FOAMING AGENT SIKA TECHNOLOGY AG (CH) 2012-03-08 US disclosed
US-20120055631-A1 HEAT CURABLE EPOXY RESIN COMPOSITION WITH WATER AS FOAMING AGENT SIKA TECHNOLOGY AG (CH) 2012-03-08 US disclosed