SCHEMBL3837629

SCHEMBL3837629

CN(C)C(=O)NCC1(C)CC(NC(=O)N(C)C)CC(C)(C)C1

nearest known ligand 0.59

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.59
TDP1 Q9NUW8 1/20 0.35
OPRM1 P35372 1/20 0.30
OPRL1 P41146 1/20 0.30
PBK Q96KB5 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14964832 1.00 TSHR (0.59) TSHRTDP1OPRM1OPRL1PBK
SCHEMBL12745259 0.85 TSHR (0.56) TSHRTDP1OPRM1OPRL1
SCHEMBL18373659 0.83 TSHR (0.57) TSHRTDP1
SCHEMBL17346759 0.83 TSHR (0.57) TSHRTDP1
SCHEMBL13098673 0.82 TSHR (0.44) TSHROPRM1OPRL1
SCHEMBL25477747 0.80 TSHR (0.51) TSHRTDP1
SCHEMBL17552110 0.80 TSHR (0.57) TSHRTDP1
SCHEMBL22198290 0.80 TSHR (0.44) TSHR
SCHEMBL17346766 0.79 TSHR (0.50) TSHRTDP1
SCHEMBL17552042 0.79 TSHR (0.52) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12305036-B2 Epoxy resin composition for semiconductor encapsulation and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-20 US claimed
EP-1996641-B1 USE OF A SUBSTITUTED GUANIDINE COMPOUND AS A HARDENER FOR EPOXY RESINS ALZCHEM TROSTBERG GMBH (DE) 2009-10-14 EP claimed
EP-4733350-A1 THERMOSETTING RESIN COMPOSITION AND A SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-29 EP disclosed
US-20260109807-A1 THERMOSETTING RESIN COMPOSITION AND A SEMICONDUCTOR DEVICE SHINETSU CHEMICAL CO (JP) 2026-04-23 US disclosed
US-20250257194-A1 A METHOD FOR THE PREPARATION OF AN EPOXY RESIN COMPOSITION FOR THE PRE-IMPREGNATION OF MATERIALS ALZCHEM TROSTBERG GMBH (DE) 2025-08-14 US disclosed
EP-4562073-A1 PROCESS FOR PRODUCING AN EPOXY RESIN COMPOSITION FOR PREIMPREGNATING MATERIALS AlzChem Trostberg GmbH (DE) 2025-06-04 EP disclosed
US-12305036-B2 Epoxy resin composition for semiconductor encapsulation and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-20 US disclosed
US-20250145872-A1 ADHESIVE COMPOSITION TOYOBO CO., LTD. (JP) 2025-05-08 US disclosed
US-20250101280-A1 ADHESIVE COMPOSITION AND LAMINATE TOYOBO CO., LTD. (JP) 2025-03-27 US disclosed
US-12259652-B2 Photosensitive dry film, and printed wiring board with photosensitive dry film TAMURA CORPORATION (JP) 2025-03-25 US disclosed
EP-4455242-A1 ADHESIVE COMPOSITION AND LAMINATE TOYOBO CO., LTD. (JP) 2024-10-30 EP disclosed
US-20150158972-A1 LIQUID HARDENERS FOR HARDENING EPOXIDE RESINS (I) ALZCHEM AG (DE) 2015-06-11 US disclosed
US-20150158970-A1 LIQUID HARDENERS FOR HARDENING EPOXIDE RESINS (II) ALZCHEM AG (DE) 2015-06-11 US disclosed
EP-2780388-B1 USE OF N,N'-(DIMETHYL) URONS AND METHOD FOR CURING EPOXY RESIN COMPOSITIONS ALZCHEM AG (DE) 2015-05-06 EP disclosed
US-8663871-B2 Resin composition for fuel cell separator, process for producing same, and fuel cell separator NICHIAS CORPORATION (JP) 2014-03-04 US disclosed
US-8663871-B2 Resin composition for fuel cell separator, process for producing same, and fuel cell separator NICHIAS CORPORATION (JP) 2014-03-04 US disclosed
WO-2013072356-A1 USE OF N,N'-(DIMETHYL) URONS AND METHOD FOR CURING EPOXY RESIN COMPOSITIONS ALZCHEM AG (DE) 2013-05-23 WO disclosed
EP-2306570-A1 RESIN COMPOSITION FOR FUEL CELL SEPARATOR, PROCESS FOR PRODUCING SAME, AND FUEL CELL SEPARATOR Nichias Corporation (JP) 2011-04-06 EP disclosed
US-20110027695-A1 RESIN COMPOSITION FOR FUEL CELL SEPARATOR, PROCESS FOR PRODUCING SAME, AND FUEL CELL SEPARATOR NICHIAS CORPORATION (JP) 2011-02-03 US disclosed
US-20110027695-A1 RESIN COMPOSITION FOR FUEL CELL SEPARATOR, PROCESS FOR PRODUCING SAME, AND FUEL CELL SEPARATOR NICHIAS CORPORATION (JP) 2011-02-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109807-A1 THERMOSETTING RESIN COMPOSITION AND A SEMICONDUCTOR DEVICE ITGA1, H1-0, ITGB1 TSHR 2709/4885TDP1 1940/4885OPRM1 1003/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.