SCHEMBL10179860

SCHEMBL10179860

CC(C)c1cc(OCC2CO2)ccc1C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.48
TP53 P04637 3/20 0.48
TSHR P16473 3/20 0.48
HIF1A Q16665 2/20 0.48
CYP3A4 P08684 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
TDP1 Q9NUW8 1/20 0.45
CAMKK1 Q8N5S9 2/20 0.45
CAMKK2 Q96RR4 2/20 0.45
MAPT P10636 2/20 0.43
HPGD P15428 2/20 0.43
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
PKM P14618 2/20 0.43
CYP1A2 P05177 1/20 0.43
PPARG P37231 1/20 0.43
LMNA P02545 1/20 0.43
GAA P10253 1/20 0.43
FGFR1 P11362 1/20 0.39
SRC P12931 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10180290 0.83 ALDH1A1 (0.53) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL11458560 0.81 ALDH1A1 (0.53) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL948171 0.80 CAMKK1 (0.62) ALDH1A1TP53TSHRHIF1ASMN1; SMN2
SCHEMBL29051126 0.80 ALDH1A1 (0.51) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL29051124 0.80 ALDH1A1 (0.51) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL19435834 0.78 ALDH1A1 (0.50) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL1202284 0.78 ALDH1A1 (0.50) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL9895719 0.78 ALDH1A1 (0.37) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL29767857 0.78 ALDH1A1 (0.47) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL15346358 0.78 ALDH1A1 (0.53) ALDH1A1TP53TSHRHIF1ACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3594259-B1 EPOXY POLYMER, EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, CURED PRODUCT, C-STAGE SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE AND METHOD FOR MANUFACTURING EPOXY RESIN RESONAC CORP (JP) 2024-04-17 EP disclosed
US-11535700-B2 Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-12-27 US disclosed
EP-2474539-B1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND SUMITOMO CHEMICAL CO (JP) 2013-11-27 EP disclosed
EP-2474539-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND Sumitomo Chemical Company, Limited (JP) 2012-07-11 EP disclosed