SCHEMBL10180290

SCHEMBL10180290

Cc1cc(OCC2CO2)ccc1C(=O)O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.53
TP53 P04637 3/20 0.53
TSHR P16473 3/20 0.53
SMN1; SMN2 Q16637 3/20 0.53
HIF1A Q16665 2/20 0.53
CYP3A4 P08684 1/20 0.53
TDP1 Q9NUW8 1/20 0.50
MAPT P10636 3/20 0.48
HPGD P15428 2/20 0.48
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
PKM P14618 2/20 0.48
LMNA P02545 2/20 0.48
CYP1A2 P05177 1/20 0.48
PPARG P37231 1/20 0.48
GAA P10253 1/20 0.48
GLA P06280 1/20 0.43
PTGIR P43119 3/20 0.42
FGFR1 P11362 1/20 0.42
SRC P12931 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7963747 0.88 ALDH1A1 (0.53) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL7963745 0.88 ALDH1A1 (0.53) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL7963743 0.88 ALDH1A1 (0.53) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL11458560 0.85 ALDH1A1 (0.53) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL28209631 0.85 TDP1 (0.51) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL29767857 0.85 ALDH1A1 (0.47) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL29051124 0.84 ALDH1A1 (0.51) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL29051126 0.84 ALDH1A1 (0.51) ALDH1A1TP53TSHRSMN1; SMN2HIF1A
SCHEMBL1390989 0.84 PARP10 (0.53)
SCHEMBL10179860 0.83 ALDH1A1 (0.48) ALDH1A1TP53TSHRSMN1; SMN2HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3594259-B1 EPOXY POLYMER, EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, CURED PRODUCT, C-STAGE SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE AND METHOD FOR MANUFACTURING EPOXY RESIN RESONAC CORP (JP) 2024-04-17 EP disclosed
US-11535700-B2 Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-12-27 US disclosed
EP-2474539-B1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND SUMITOMO CHEMICAL CO (JP) 2013-11-27 EP disclosed
EP-2474539-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND Sumitomo Chemical Company, Limited (JP) 2012-07-11 EP disclosed