SCHEMBL10248366

SCHEMBL10248366

CC(C)(C)CC(C(=O)OC(C)(C)C)C(C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA7 P43166 1/20 0.35
CTSS P25774 1/20 0.33
CTSK P43235 1/20 0.33
KMT2A Q03164 2/20 0.32
LMNA P02545 1/20 0.32
CYP2D6 P10635 1/20 0.32
DGAT1 O75907 1/20 0.31
NOS1 P29475 2/20 0.31
NOS3 P29474 1/20 0.31
NOS2 P35228 1/20 0.31
MEN1 O00255 1/20 0.31
GAA P10253 1/20 0.31
ABCB1 P08183 1/20 0.31
APLNR P35414 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22810787 1.00 CA1 (0.35) CA1CA2CA7CTSSCTSK
SCHEMBL12465045 0.87 DGAT1 (0.34) CA1CA2CA7CTSSCTSK
SCHEMBL24439165 0.83 CA1 (0.33) CA1CA2CA7CTSSCTSK
SCHEMBL23395735 0.83
SCHEMBL19142656 0.83
SCHEMBL18467688 0.83
SCHEMBL13360961 0.82 ALDH1A1 (0.30)
SCHEMBL26689103 0.82 CA1 (0.33) CA1CA2CA7
SCHEMBL19901528 0.80
SCHEMBL26040962 0.80 CYP3A4 (0.30) CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230384671-A1 LAMINATE OF NEGATIVE TONE LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PREPARING NEGATIVE TONE LITHOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2023-11-30 US disclosed
EP-3677435-B1 PRINTING PLATE PRECURSOR AND PRINTING PLATE PRECURSOR LAMINATE FUJIFILM CORP (JP) 2023-09-06 EP disclosed
WO-2023140386-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN 東京応化工業株式会社 2023-07-27 WO disclosed
US-20230161247-A1 ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD FUJIFILM CORPORATION (JP) 2023-05-25 US disclosed
US-20230161247-A1 ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD FUJIFILM CORPORATION (JP) 2023-05-25 US disclosed
US-20210372895-A1 HYDROPHILIC SUBSTRATE AND METHOD FOR PREPARING HYDROPHILIC SUBSTRATE SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2021-12-02 US disclosed
US-10919331-B2 Lithographic printing plate precursor, method of producing same, lithographic printing plate precursor laminate, and lithographic printing method FUJIFILM CORPORATION (JP) 2021-02-16 US disclosed
WO-2021024925-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD FOR PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD FOR PATTERNED RESIST FILM, AND PRODUCTION METHOD FOR COMPOUND, PHOTO-ACID GENERATOR, AND N–ORGANOSULFONYLOXY COMPOUND 東京応化工業株式会社 2021-02-11 WO disclosed
US-20210018836-A1 PHOTORESIST COMPOSITION FOR THICK FILM AND METHOD OF FORMING THICK FILM PHOTORESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-01-21 US disclosed
US-20200353768-A1 LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PRODUCING SAME, LITHOGRAPHIC PRINTING PLATE PRECURSOR LAMINATE, AND LITHOGRAPHIC PRINTING METHOD FUJIFILM CORPORATION (JP) 2020-11-12 US disclosed
EP-1925979-A1 Positive photosensitive composition, polymer compound used for the positive photosensitive composition, production method of the polymer compound, and pattern forming method using the positive photosensitive composition FUJIFILM Corporation (JP) 2008-05-28 EP disclosed
US-20080085464-A1 POSITIVE PHOTOSENSITIVE COMPOSITION, POLYMER COMPOUNDS FOR USE IN THE POSITIVE PHOTOSENSITIVE COMPOSITION, MANUFACTURING METHOD OF THE POLYMER COMPOUNDS, COMPOUNDS FOR USE IN THE MANUFACTURE OF THE POLYMER COMPOUNDS, AND PATTERN-FORMING METHOD USING THE POSITIVE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2008-04-10 US disclosed
EP-1906241-A1 Resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2008-04-02 EP disclosed
EP-1835341-A1 Positive resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2007-09-19 EP disclosed
EP-1811338-A2 Pattern forming method Fujifilm Corporation (JP) 2007-07-25 EP disclosed
US-20070141512-A1 Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition FUJIFILM CORPORATION (JP) 2007-06-21 US disclosed
US-20070134590-A1 Resin showing an increase in solubility in alkali developer by action of an acid, a compound being capable of generating an acid when irradiated with an actinic ray or radiation, an acrylic resin with silicon-containing units and being stable to acids but insoluble in alkali developer, solvent FUJIFILM CORPORATION. (JP) 2007-06-14 US disclosed
US-20070122741-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
US-20070082289-A1 Photosensitive composition, pattern forming method using the photosensitive composition and compound for use in the photosensitive composition FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed
EP-1764652-A2 Positive resist composition and pattern-forming method using the same FUJIFILM Corporation (JP) 2007-03-21 EP disclosed