SCHEMBL102596

SCHEMBL102596

Cc1ccc2[nH]nnc2c1C

nearest known ligand 0.37

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CBFB Q13951 1/20 0.37
KDM4E B2RXH2 1/20 0.33
MAPT P10636 1/20 0.33
MAPK1 P28482 1/20 0.33
ADAMTS5 Q9UNA0 1/20 0.31
EGLN1 Q9GZT9 1/20 0.31
PDE2A O00408 1/20 0.31
PDE3B Q13370 1/20 0.31
PDE3A Q14432 1/20 0.31
P2RY12 Q9H244 1/20 0.31
ADORA3 P0DMS8 1/20 0.30
ADORA2A P29274 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL28270232 0.98 CBFB (0.36) CBFBKDM4EMAPTMAPK1ADAMTS5
Water SCHEMBL11194639 0.94 CBFB (0.34) CBFBKDM4EMAPTMAPK1
SCHEMBL1021251 0.79 KDM4E (0.37) KDM4EMAPTADORA3ADORA2A
SCHEMBL21563201 0.79
SCHEMBL1019781 0.79 MAPT (0.46) MAPT
SCHEMBL1020657 0.79 GRM4 (0.33) PDE3BPDE3A
SCHEMBL3259924 0.79
SCHEMBL25672720 0.79 HRH4 (0.35) EGLN1
SCHEMBL8622721 0.79 ADRB2 (0.33) KDM4EADORA3ADORA2A
SCHEMBL1426962 0.79 GRM4 (0.33) MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 351 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630744-B2 Polishing compositions and methods of use thereof FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2026-05-19 US claimed
CN-122038059-A Cleaning composition for removing post-etch residues 恩特格里斯公司 2026-05-15 CN claimed
US-12590224-B2 Chemical mechanical polishing compositions and methods of use thereof FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2026-03-31 US claimed
EP-4688987-A1 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2026-02-11 EP claimed
EP-4653506-A1 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2025-11-26 EP claimed
EP-4647474-A2 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A., Inc. (US) 2025-11-12 EP claimed
US-20250333622-A1 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MAT USA INC (US) 2025-10-30 US claimed
EP-4626996-A1 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2025-10-08 EP claimed
US-12398291-B2 Polishing compositions and methods of use thereof FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-08-26 US claimed
US-12371589-B2 Polishing compositions and methods of use thereof FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-07-29 US claimed
EP-1051888-B1 PROCESS AND SOLUTION FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2002-03-27 EP claimed
EP-1055355-B1 PROCESS FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2001-12-05 EP claimed
EP-1055355-A1 PROCESS FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES ATOTECH Deutschland GmbH (DE) 2000-11-29 EP claimed
EP-1051888-A1 PROCESS AND SOLUTION FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES ATOTECH Deutschland GmbH (DE) 2000-11-15 EP claimed
WO-1999040764-A1 PROCESS AND SOLUTION FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 1999-08-12 WO claimed
WO-1999040765-A1 PROCESS FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 1999-08-12 WO claimed
EP-0371522-A1 Use of a curing catalyst in the preparation of a powder coating composition DSM N.V. (NL) 1990-06-06 EP claimed
EP-0151813-B1 A PROCESS FOR PHOSPHATIZING AND USE THEREOF HENKEL CORPORATION (a Delaware corp.) (US) 1990-05-02 EP claimed
US-4540442-A ALKANOLAMINE, CARBOXYLIC ACID, TRIAZOLE AMCHEM PRODUCTS, INC. (US) 1985-09-10 US claimed
EP-0151813-A2 A process for phosphatizing and use thereof HENKEL CORPORATION (a Delaware corp.) (US) 1985-08-21 EP claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12590224-B2 Chemical mechanical polishing compositions and methods of use thereof PHOSPHO1, ACP1, PLEC CBFB 2303/4885KDM4E 1188/4885MAPT 2861/4885
US-12630744-B2 Polishing compositions and methods of use thereof ZAP70, PRKDC, PEAK1 CBFB 758/4885KDM4E 129/4885MAPT 2759/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.