SCHEMBL1027391

SCHEMBL1027391

CC(C)(C)c1cccc(C(C)(C)C)c1C(CCO)OP(O)O

nearest known ligand 0.36

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.36
GABRA1 P14867 1/20 0.33
GABRB2 P47870 1/20 0.33
ALDH1A1 P00352 2/20 0.32
TSHR P16473 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1028547 0.87 CA2 (0.38) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL1074820 0.83 SMN1; SMN2 (0.38) CA2ALDH1A1
SCHEMBL1030488 0.79 SCN4A (0.33) CA2ALDH1A1TSHRKDM4E
SCHEMBL29771369 0.77 CA2 (0.33) CA2
SCHEMBL8389968 0.76 CA2 (0.43) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL7637604 0.76 CA2 (0.39) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL1031490 0.75 SMN1; SMN2 (0.36) CA2ALDH1A1
SCHEMBL1028982 0.74 CYP1A2 (0.33) ALDH1A1TSHRTDP1
SCHEMBL1027993 0.73 LMNA (0.39) TSHR
SCHEMBL28519584 0.71 TSHR (0.34) CA2ALDH1A1TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2740590-B1 PANEL AND PANEL INSTALLATION STRUCTURE MITSUBISHI ENG PLASTICS CORP (JP) 2021-03-31 EP disclosed
US-20150239197-A1 ARTICLE AND LAMINATE SUMITOMO BAKELITE CO., LTD. (JP) 2015-08-27 US disclosed
US-20140178635-A1 PANEL AND PANEL INSTALLATION STRUCTURE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2014-06-26 US disclosed
EP-2740590-A1 PANEL AND PANEL INSTALLATION STRUCTURE Mitsubishi Engineering-Plastics Corporation (JP) 2014-06-11 EP disclosed
EP-1160273-B1 POROUS RESIN FILM YUPO CORP (JP) 2011-01-19 EP disclosed
US-6911253-B2 Porous resin film YUPO CORPORATION (JP) 2005-06-28 US disclosed
EP-0791634-B1 Fire retardant polyester resin composition and process for producing the same MITSUBISHI ENG PLASTICS CORP (JP) 2002-11-06 EP disclosed
US-20020012786-A1 Blend of thermoplastic resin and fine powder; ink jet recording YUPO CORPORATION (JP) 2002-01-31 US disclosed
EP-1160273-A1 POROUS RESIN FILM Yupo Corporation (JP) 2001-12-05 EP disclosed
EP-0593054-B1 Process for preparing a thermoplastic resin composition MITSUBISHI CHEM CORP (JP) 2000-08-02 EP disclosed
US-5770644-A FIREPROOFING MOLDING MATERIAL BLENDS COMPRISING A POLYESTERS, A POLYPHENYLENE ETHER RESIN AND/OR POLYPHENYLENE SULFIDE RESIN AND A COMPATIBILIZING AGENT; NONHYDROLYSIS, FLEXIBILITY, DIMENSION STABILITY, CORROSION RESISTANCE MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 1998-06-23 US disclosed
EP-0791634-A2 Fire retardant polyester resin composition and process for producing the same Mitsubishi Engineering Plastics Corporation (JP) 1997-08-27 EP disclosed
EP-0765914-A1 POLYPHENYLENE ETHER RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 1997-04-02 EP disclosed
US-5420184-A Polyphenylene ether, polyester, phosphite MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1995-05-30 US disclosed
EP-0593054-A2 Thermoplastic resin composition and process for preparing the same MITSUBISHI CHEMICAL CORPORATION (JP) 1994-04-20 EP disclosed