SCHEMBL10277414

SCHEMBL10277414

CO[Si](OC)(OC)c1ccc2c3c(cccc13)CC2

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 11/20 0.47
▸ KDM4E B2RXH2 9/20 0.47
▸ HPGD P15428 7/20 0.47
▸ MAPT P10636 5/20 0.47
▸ MEN1 O00255 4/20 0.47
▸ KMT2A Q03164 4/20 0.47
▸ LMNA P02545 4/20 0.47
▸ GAA P10253 3/20 0.47
▸ HSD17B10 Q99714 2/20 0.41
▸ CYP3A4 P08684 1/20 0.41
▸ ALOX15 P16050 1/20 0.41
▸ CYP11B1 P15538 1/20 0.41
▸ CYP11B2 P19099 1/20 0.41
▸ POLB P06746 3/20 0.40
▸ NPC1 O15118 2/20 0.40
▸ RAB9A P51151 2/20 0.40
▸ CYP1A2 P05177 1/20 0.40
▸ CYP2C19 P33261 1/20 0.40
▸ SMN1; SMN2 Q16637 2/20 0.40
▸ ATM Q13315 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28213214 0.85 ALDH1A1 (0.47) ALDH1A1KDM4EHPGDMAPTMEN1
SCHEMBL20466119 0.74 KDM4E (0.48) ALDH1A1KDM4EHPGDMAPTKMT2A
SCHEMBL6749506 0.73 ALDH1A1 (0.39) ALDH1A1KDM4EHPGDHSD17B10CYP3A4
SCHEMBL28382420 0.73 KDM4E (0.31) ALDH1A1KDM4ESMN1; SMN2
SCHEMBL10955825 0.72 ALDH1A1 (0.45) ALDH1A1KDM4EHPGDMAPTMEN1
SCHEMBL18499935 0.72 KMT2A (0.68) ALDH1A1KDM4EHPGDMAPTMEN1
SCHEMBL2553765 0.70 ALDH1A1 (0.48) ALDH1A1KDM4EHPGDMAPTMEN1
SCHEMBL29777501 0.70 ALDH1A1 (0.48) ALDH1A1KDM4EHPGDMAPTMEN1
SCHEMBL19328140 0.69 ALDH1A1 (0.35) ALDH1A1HPGDHSD17B10CYP3A4POLB
SCHEMBL5372884 0.69 TYMS (0.65) ALDH1A1KDM4EHPGDMAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025022873-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND FINGERPRINT AUTHENTICATION DEVICE USING SAID CURED FILM 東レ株式会社 2025-01-30 — — WO disclosed
CN-117859098-A Photosensitive resin composition and microlens 东丽株式会社 2024-04-09 — — CN disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 — — US disclosed
US-11650499-B2 Photosensitive resin composition, organic EL element barrier rib, and organic EL element SHOWA DENKO K.K. (JP) 2023-05-16 — — US disclosed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 — — US disclosed
WO-2023054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, MICROLENS 東レ株式会社 2023-04-06 — — WO disclosed
US-11599023-B2 Photosensitive resin composition, organic EL element barrier rib, and organic EL element SHOWA DENKO K.K. (JP) 2023-03-07 — — US disclosed
EP-3369780-B1 METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT USING SAME TORAY INDUSTRIES (JP) 2022-10-26 — — EP disclosed
US-20220275241-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL SHOWA DENKO K.K. (JP) 2022-09-01 — — US disclosed
WO-2022163335-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND 東レ株式会社 2022-08-04 — — WO disclosed
EP-3018532-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED BY CURING SAME, AND OPTICAL DEVICE EQUIPPED WITH SAME Toray Industries, Inc. (JP) 2016-05-11 — — EP disclosed
CN-105359037-A Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same TORAY INDUSTRIES 2016-02-24 — — CN disclosed
CN-102667625-B Positive type photosensitive organic compound, the cured film formed by said composition and there is the element of cured film TORAY INDUSTRIES, INC. (JP) 2015-11-25 — — CN disclosed
US-8828642-B2 Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES, INC. (JP) 2014-09-09 — — US disclosed
CN-102472964-B Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES 2013-08-07 — — CN disclosed
US-20120237873-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM TORAY INDUSTRIES INC. (JP) 2012-09-20 — — US disclosed
CN-102667625-A Positive photosensitive resin composition, cured film formed from the same, and device having cured film TORAY INDUSTRIES 2012-09-12 — — CN disclosed
EP-2485091-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE Toray Industries, Inc. (JP) 2012-08-08 — — EP disclosed
US-20120178022-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE TORAY INDUSTRIES, INC. (JP) 2012-07-12 — — US disclosed
CN-102472964-A Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES 2012-05-23 — — CN disclosed
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