SCHEMBL1029468

SCHEMBL1029468

CO[PH](=O)c1ccc(C(=O)c2c(C)cc(C)cc2C)cc1

nearest known ligand 0.49

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.49
HPGD P15428 2/20 0.49
LMNA P02545 2/20 0.49
SMN1; SMN2 Q16637 2/20 0.49
MEN1 O00255 2/20 0.49
NPSR1 Q6W5P4 1/20 0.49
MCOLN3 Q8TDD5 1/20 0.49
ALDH1A1 P00352 2/20 0.38
PKM P14618 1/20 0.36
FFAR4 Q5NUL3 1/20 0.35
SRD5A2 P31213 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
HTT P42858 1/20 0.34
CRHR1 P34998 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2835341 0.84 MAPT (0.40) KMT2ALMNAMEN1NPSR1ALDH1A1
SCHEMBL1033664 0.83 HPGD (0.52) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL335891 0.83 HPGD (0.52) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL3685862 0.83 KMT2A (0.54) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL5713051 0.81 KMT2A (0.53) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL1517886 0.81 KMT2A (0.43) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL28274214 0.80 KMT2A (0.67) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL7210992 0.79 HPGD (0.45) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL28242772 0.78 KMT2A (0.65) KMT2AHPGDLMNASMN1; SMN2MEN1
SCHEMBL9856924 0.77 ALDH1A1 (0.65) KMT2AHPGDLMNASMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3419051-B1 CURABLE RESIN COMPOSITION AND FAN OUT TYPE WAFER LEVEL PACKAGE TAIYO HOLDINGS CO LTD (JP) 2026-04-08 EP disclosed
US-12443101-B2 Cured coating film TAIYO HOLDINGS CO., LTD. (JP) 2025-10-14 US disclosed
US-20250289975-A1 CURED PRODUCT AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2025-09-18 US disclosed
WO-2025100183-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2025-05-15 WO disclosed
EP-4502077-A1 CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2025-02-05 EP disclosed
US-20240409750-A1 HIGH ENERGY RAY-CURABLE COMPOSITION AND USE OF SAME DOW TORAY CO LTD (JP) 2024-12-12 US disclosed
US-20240343945-A1 CURABLE HOT MELT SILICONE COMPOSITION, CURED PRODUCT OF SAID COMPOSITION, AND METHOD FOR PRODUCING FILM OR THE LIKE COMPRISING SAID COMPOSITION DOW TORAY CO LTD (JP) 2024-10-17 US disclosed
WO-2024195797-A1 LAMINATED STRUCTURE, CURED PRODUCT, AND PRINTED WIRING BOARD 太陽ホールディングス株式会社 2024-09-26 WO disclosed
WO-2024190304-A1 RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, DRY FILM FOR OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE パナソニックIPマネジメント株式会社 2024-09-19 WO disclosed
WO-2024161723-A1 CURED FILM, LAMINATED STRUCTURE WITH CURED FILM, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2024-08-08 WO disclosed
EP-2277956-A1 ENERGY RAY-CURABLE INKJET INK COMPOSITION Hitachi Maxell, Ltd. (JP) 2011-01-26 EP disclosed
US-20100264378-A1 PHOTOSENSITIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY FUJIFILM CORPORATION (JP) 2010-10-21 US disclosed
US-20100008876-A1 Artificial nail composition having improved curability KABUSHIKI KAISHA SHOFU (JP) 2010-01-14 US disclosed
US-6759104-B2 LIQUID CRYSTALS DISPLAY; MIXTURE CONTAINING ACRYLATED ESTERS; PHOTOPOLYMERIZATION USING FREE RADICAL CATALYSTS MITSUBISHI CHEMICAL CORPORATION (JP) 2004-07-06 US disclosed
EP-0948955-B1 POLYMERIZABLE DENTAL COMPOSITION KURARAY CO (JP) 2003-09-03 EP disclosed
US-20030118941-A1 Photocurable composition, cured product and process for producing the same MITSUBISHI CHEMICAL CORPORATION (JP) 2003-06-26 US disclosed
EP-1275668-A1 PHOTOCURABLE COMPOSITION, CURED OBJECT, AND PROCESS FOR PRODUCING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2003-01-15 EP disclosed
US-6191191-B1 USED AS BONDING AGENT, COMPOSITE RESIN, ADHESIVE AGENT, PRIMER AND OPAQUE PRIMER FOR DENTAL USE; LIGHT RESISTANCE; ADHESION TO TOOTH SURFACE AND METALS; COLORFASTNESS KURARAY CO., LTD. (JP) 2001-02-20 US disclosed
EP-0948955-A1 POLYMERIZABLE DENTAL COMPOSITION KURARAY CO., LTD. (JP) 1999-10-13 EP disclosed
US-4839261-A FORMING ELECTROLESS COPPER PLATING PATTERNS ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1989-06-13 US disclosed