SCHEMBL10331908

SCHEMBL10331908

CC1CC2CC1C1C3OC3C21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11965968 0.79 PPP5C (0.36)
SCHEMBL10035492 0.75
SCHEMBL14527639 0.71
SCHEMBL12791005 0.71
SCHEMBL19829297 0.70
SCHEMBL13636455 0.68
SCHEMBL21350615 0.68
SCHEMBL3455721 0.67
SCHEMBL3412054 0.67
SCHEMBL12510553 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230056225-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-23 US disclosed
US-20200139433-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE FINE PARTICLE, METHOD FOR PRODUCING IMPROVED METAL OXIDE FINE PARTICLES, SURFACE-MODIFIED METAL OXIDE FINE PARTICLES, AND METAL OXIDE FINE PARTICLE DISPERSION LIQUID TOKYO OHKA KOGYO CO., LTD. (JP) 2020-05-07 US disclosed
US-10239989-B2 Curable composition TOKYO OHKA KOGYO CO., LTD. (JP) 2019-03-26 US disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 US disclosed
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-20120183776-A1 CURABLE COMPOSITION, CURABLE FILM, CURABLE LAMINATE, METHOD FOR FORMING A PERMANENT PATTERN, AND PRINTED SUBSTRATE FUJIFILM CORPORATION (JP) 2012-07-19 US disclosed