⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL30967362 | 0.97 | — | — | |
| SCHEMBL7474406 | 0.87 | — | — | |
| SCHEMBL7473454 | 0.87 | — | — | |
| SCHEMBL13060365 | 0.84 | ALDH1A1 (0.45) | — | |
| SCHEMBL8760180 | 0.84 | KMT2A (0.47) | — | |
| SCHEMBL10842765 | 0.82 | ALDH1A1 (0.43) | — | |
| SCHEMBL21585679 | 0.80 | EPHX2 (0.34) | — | |
| SCHEMBL8985133 | 0.73 | EPHX1 (0.30) | — | |
| SCHEMBL11655888 | 0.71 | — | — | |
| Hydrochloric Acid SCHEMBL30639430 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| EP-0102052-B1 | HEAT-RESISTANT RESIN, THERMOSETTING COMPOSITION AFFORDING THE SAME AND PREPOLYMER THEREOF | HITACHI, LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0102052-A2 | Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof | HITACHI, LTD. (JP) | 1984-03-07 | — | — | EP | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |
| US-4066577-A | HIGH MOLECULAR WEIGHT POLYTRIAZINES OF SOLUBLE POLYMERIC N-CYANO-ISOUREA ETHERS | BAYER AKTIENGESELLSCHAFT (DT) | 1978-01-03 | — | — | US | disclosed |