Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10353084 | 0.84 | — | — | |
| Hydrochloric Acid SCHEMBL30967362 | 0.81 | — | — | |
| SCHEMBL11480143 | 0.75 | KMT2A (0.42) | KMT2A | |
| SCHEMBL7474406 | 0.73 | — | — | |
| SCHEMBL7473454 | 0.73 | — | — | |
| SCHEMBL12448329 | 0.71 | KMT2A (0.48) | KMT2AEGFR | |
| SCHEMBL13060365 | 0.70 | ALDH1A1 (0.45) | — | |
| SCHEMBL10842765 | 0.69 | ALDH1A1 (0.43) | — | |
| SCHEMBL301106 | 0.67 | — | — | |
| SCHEMBL21585679 | 0.67 | EPHX2 (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| JP-58125719-A | — | — | None | — | — | JP | disclosed |
| JP-60092328-A | — | — | None | — | — | JP | disclosed |
| EP-0440923-B1 | Polyolefin resin compositions and process for producing same | SUMITOMO CHEMICAL CO (JP) | 1997-06-04 | — | — | EP | disclosed |
| US-5587427-A | MELTING, KNEADING A POLYOLEFIN, A FUNCTIONAL COMPOUND AND APOLAR COMPOUND | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1996-12-24 | — | — | US | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0440923-A1 | Polyolefin resinsompositions and process for producing same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-08-14 | — | — | EP | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| JP-S6092328-A | THERMOSETTING RESIN COMPOSITION | HITACHI LTD | 1985-05-23 | — | — | JP | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| JP-S58125719-A | THERMOSETTING RESIN COMPOSITION AND ITS PREPOLYMER | HITACHI LTD | 1983-07-26 | — | — | JP | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |
| US-4199466-A | CYANOAMINES | SHELL OIL COMPANY (US) | 1980-04-22 | — | — | US | disclosed |
| US-4066577-A | HIGH MOLECULAR WEIGHT POLYTRIAZINES OF SOLUBLE POLYMERIC N-CYANO-ISOUREA ETHERS | BAYER AKTIENGESELLSCHAFT (DT) | 1978-01-03 | — | — | US | disclosed |