SCHEMBL10364019

SCHEMBL10364019

CC(N)n1ccnc1-c1ccccc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BRD4 O60885 1/20 0.44
ESR1 P03372 1/20 0.41
KMT2A Q03164 1/20 0.38
NPC1 O15118 1/20 0.37
RAB9A P51151 1/20 0.37
NR1H2 P55055 1/20 0.37
NR1H3 Q13133 1/20 0.37
KDR P35968 9/20 0.36
LIMK1 P53667 2/20 0.36
MAPK14 Q16539 2/20 0.36
CHEK1 O14757 2/20 0.36
KDM4E B2RXH2 1/20 0.36
ALDH1A1 P00352 1/20 0.36
MAPT P10636 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
PRKACA P17612 2/20 0.36
CDK8 P49336 2/20 0.36
MAP2K1 Q02750 2/20 0.36
ACVR1 Q04771 2/20 0.36
ROCK1 Q13464 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL10366280 0.98 BRD4 (0.43) BRD4ESR1KMT2ANPC1RAB9A
SCHEMBL9444404 0.87 BRD4 (0.47) BRD4ESR1NPC1RAB9ANR1H2
SCHEMBL10529530 0.81 ESR1 (0.41) BRD4ESR1KMT2ANPC1RAB9A
SCHEMBL29013599 0.81 KDM4E (0.42) BRD4ESR1RAB9AKDM4EALDH1A1
SCHEMBL84081 0.78 BRD4 (0.41) BRD4ESR1KMT2ANPC1RAB9A
SCHEMBL27217012 0.78 ESR1 (0.42) BRD4ESR1KMT2ANPC1RAB9A
Hydrogen Sulfide SCHEMBL28846015 0.77 BRD4 (0.40) BRD4ESR1KMT2ANPC1RAB9A
SCHEMBL136105 0.77 BRD4 (0.43) BRD4ESR1NPC1RAB9ANR1H2
SCHEMBL11579315 0.74 TSHR (0.49) BRD4ESR1KMT2ANR1H2NR1H3
SCHEMBL27504005 0.74 BRD4 (0.39) BRD4ESR1KDRFLT1FLT4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0239246-B1 NOVEL IMIDAZOLE COMPOUNDS, PROCESS FOR SYNTHESIS THEREOF, AND METHOD OF CURING EPOXY RESINS USING SAID COMPOUNDS SHIKOKU CHEMICALS CORPORATION (JP) 1990-05-16 EP claimed
EP-0239246-A1 Novel imidazole compounds, process for synthesis thereof, and method of curing epoxy resins using said compounds SHIKOKU CHEMICALS CORPORATION (JP) 1987-09-30 EP claimed
CN-107614619-B Thermosetting material and cured product 积水化学工业株式会社 2023-05-09 CN disclosed
CN-107614619-A Thermoset materials and solidfied material 积水化学工业株式会社 2018-01-19 CN disclosed
CN-106832221-B The photocuring of structure containing oxazolidone heat reactive resin, its preparation method and the photosensitive solder resist material containing it 佛山市三求光固材料股份有限公司 2017-12-29 CN disclosed
CN-106832221-A The photocuring of structure containing oxazolidone heat reactive resin, its preparation method and the photosensitive solder resist material containing it 佛山市三求光固材料股份有限公司 2017-06-13 CN disclosed
CN-102414241-A Microencapsulated composition containing imidazole compound, curable composition using same, and masterbatch-type curing agent ASAHI KASEI E MATERIALS CORP 2012-04-11 CN disclosed
CN-101501560-B Liquid crystal sealing material, process for production of liquid crystal display panels with the same, and liquid crystal display panels MITSUI CHEMICALS INC 2012-01-11 CN disclosed
CN-101501560-A Liquid crystal sealing material, process for production of liquid crystal display panels with the same, and liquid crystal display panels MITSUI CHEMICALS INC (JP) 2009-08-05 CN disclosed
EP-0239246-B1 NOVEL IMIDAZOLE COMPOUNDS, PROCESS FOR SYNTHESIS THEREOF, AND METHOD OF CURING EPOXY RESINS USING SAID COMPOUNDS SHIKOKU CHEMICALS CORPORATION (JP) 1990-05-16 EP disclosed
US-4826991-A Production of 1-aminoethyl-imidazoles via the hydrolysis of 1-acylaminoethylimidazoles SHIKOKU CHEMICALS CORPORATION (JP) 1989-05-02 US disclosed
EP-0239246-A1 Novel imidazole compounds, process for synthesis thereof, and method of curing epoxy resins using said compounds SHIKOKU CHEMICALS CORPORATION (JP) 1987-09-30 EP disclosed