SCHEMBL84081

SCHEMBL84081

CC(C#N)n1ccnc1-c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BRD4 O60885 1/20 0.41
ESR1 P03372 1/20 0.38
KDM4E B2RXH2 1/20 0.37
CHEK1 O14757 1/20 0.37
ALDH1A1 P00352 1/20 0.37
MAPT P10636 1/20 0.37
LIMK1 P53667 1/20 0.37
MAPK14 Q16539 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
KDR P35968 7/20 0.36
ABCC9 O60706 1/20 0.35
NTRK1 P04629 1/20 0.35
PIM1 P11309 1/20 0.35
NPC1 O15118 1/20 0.34
RAB9A P51151 1/20 0.34
NR1H2 P55055 1/20 0.34
NR1H3 Q13133 1/20 0.34
BACE1 P56817 1/20 0.34
FLT1 P17948 1/20 0.33
FLT4 P35916 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrogen Sulfide SCHEMBL28846015 0.98 BRD4 (0.40) BRD4ESR1KDM4ECHEK1ALDH1A1
SCHEMBL28256120 0.94 BRD4 (0.38) BRD4ESR1KDM4ECHEK1ALDH1A1
Mellitic Acid SCHEMBL28628589 0.90 ESR1 (0.41) BRD4ESR1ABCC9KMT2A
2-Phenylimidazole SCHEMBL16267717 0.87 NISCH (0.51) BRD4ESR1KDM4EALDH1A1
SCHEMBL21990719 0.84 BRD4 (0.37) BRD4ESR1KDM4EALDH1A1MAPT
SCHEMBL7649337 0.83 HSD11B1 (0.41) BRD4
SCHEMBL9444404 0.83 BRD4 (0.47) BRD4ESR1KDM4ECHEK1ALDH1A1
SCHEMBL154796 0.82 KDM4E (0.39) BRD4ESR1KDM4ENTRK1RAB9A
SCHEMBL27504005 0.80 BRD4 (0.39) BRD4ESR1KDRABCC9NTRK1
SCHEMBL10364019 0.78 BRD4 (0.44) BRD4ESR1KDM4ECHEK1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 7127 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122091303-A Low-temperature conductive paste for metal plate printing and preparation method thereof 2026-05-26 CN claimed
CN-121174379-B Novel notebook flexible printed circuit board and backlight module prepared based on weldable low-temperature silver paste 北京中科纳通电子技术有限公司 2026-05-15 CN claimed
US-20250333594-A1 RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-10-30 US claimed
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
CN-119978952-A Antistatic and dustproof coating for photovoltaic module and preparation method thereof 珠海城市职业技术学院 2025-05-13 CN claimed
CN-119662145-A Pure adhesive film and preparation method thereof 惠州市宏天电子材料有限公司 2025-03-21 CN claimed
CN-119529730-A Adhesive capable of being rapidly cured at low temperature, preparation method thereof and printing screen 江苏镭利电子材料有限公司 2025-02-28 CN claimed
CN-119490771-A Thermosetting insulating adhesive, preparation method and application thereof 杭州福斯特应用材料股份有限公司 2025-02-21 CN claimed
CN-119039912-A Epoxy resin adhesive and preparation method thereof 深圳市飞荣达科技股份有限公司 2024-11-29 CN claimed
CN-119039568-A Curing agent composition for epoxy resin and epoxy resin composition 上海华谊树脂有限公司 2024-11-29 CN claimed
EP-0349763-B1 Compositions for enhancing transdermal penetration BRISTOL MYERS SQUIBB CO (US) 1993-12-08 EP claimed
US-5112989-A Process for producing unsaturated mono and dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS LTD. (JP) 1992-05-12 US claimed
EP-0387381-A1 Process for producing unsaturated dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1990-09-19 EP claimed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 US claimed
US-4294950-A POLYVALENT CARBOXYLIC ACID BONDED THERETO ITO OPTICAL INDUSTRIAL CO., LTD. (JP) 1981-10-13 US claimed
US-4110364-A AND BISMALEIIMIDES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1978-08-29 US claimed
US-4070416-A POLYFUNCTIONAL ISOCYANATES AND EPOXIDES, ISOCYANURATE-OXAZOLIDOLE POLYMERS HITACHI, LTD. (JA) 1978-01-24 US claimed
US-4026872-A PHENOLIC CURING AGENTS HITACHI, LTD. (JA) 1977-05-31 US claimed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 US claimed