SCHEMBL10423

SCHEMBL10423

N#CC=CC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL996827 1.00
SCHEMBL8799194 1.00
SCHEMBL17912275 1.00 TSHR (0.47)
Ammonia Solution, Strong SCHEMBL28308995 0.97
Ammonia Solution, Strong SCHEMBL28313820 0.97
SCHEMBL11460249 0.97
Acrylic Acid SCHEMBL16468074 0.89 LMNA (0.50)
SCHEMBL6469186 0.89 TSHR (0.38)
SCHEMBL8380503 0.89 TSHR (0.38)
Phosphoric Acid SCHEMBL19260927 0.89 TSHR (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 148746 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260148750-A1 THERMO-MECHANICAL-OPTICAL BONDING OF LUBRICANTS TO CARBON OVERCOAT OF MAGNETIC RECORDING MEDIA WESTERN DIGITAL TECHNOLOGIES, INC. (US) 2026-05-28 US claimed
US-20260146021-A1 PROCESS OF PREPARATION OF METHYLENE DICARBOXYLATES CRACKLESS MONOMERS CO., LTD (TW) 2026-05-28 US claimed
EP-4747302-A2 REPAIR AND OPTIMIZATION OF NANOCOMPOSITE MATERIALS Nanocore ApS (DK) 2026-05-27 EP claimed
EP-4748824-A1 PROCESS OF PREPARATION OF METHYLENE DICARBOXYLATES Crackless Monomers Co., Ltd (TW) 2026-05-27 EP claimed
CN-121804638-B Wiring method and wiring device for distributed optical fiber vibration measuring sensor of bridge structure UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY (CN) 2026-05-26 CN claimed
CN-122080816-A Low-whitening ethyl cyanoacrylate adhesive composition and preparation method thereof 2026-05-26 CN claimed
CN-122080590-A High-heat-conductivity low-water-absorption epoxy molding compound for semiconductors 2026-05-26 CN claimed
US-12636198-B2 Bandage for providing protection and antimicrobial properties to a surgical site with one or more percutaneous pins or wires ORTHOBARRIER TECHNOLOGIES LLC (US) 2026-05-26 US claimed
CN-122073307-A Separator and application thereof 深圳市豪鹏科技股份有限公司 2026-05-22 CN claimed
CN-122071578-A Thermo-mechanical-optical bonding method for lubricants of carbon overcoat of magnetic recording media 西部数据技术公司 2026-05-22 CN claimed
US-4076863-A COATING WITH POLYMER PRECURSORS, POLYMERIZING HOYA LENS CORPORATION (JA) 1978-02-28 US claimed
US-4069049-A Process for recording holographic information YEDA RESEARCH & DEVELOPMENT CO., LTD. (IL) 1978-01-17 US claimed
US-4053385-A BONDING STABLE MATERIALS TO RESINOUS CELL FRAMES BASF WYANDOTTE CORPORATION (US) 1977-10-11 US claimed
US-4049526-A Extended-life electrode OXY METAL INDUSTRIES CORPORATION (US) 1977-09-20 US claimed
US-4038345-A HIGH VISCOSITY CYANOACRYLATE ADHESIVE COMPOSITIONS, AND PROCESS FOR THEIR PREPARATION LOCTITE (IRELAND), LIMITED (EI) 1977-07-26 US claimed
US-4035334-A 2-ETHOXYETHYL-A-CYANOACRYLATE, POLYVINYL BUTYL ETHER, ANTHRAQUINONE DYES DAVYDOV ANATOLY BORISOVICH 1977-07-12 US claimed
US-4025677-A Temporary patch for a crack in the wall of a container BELKE MANUFACTURING COMPANY, INC. (US) 1977-05-24 US claimed
US-4007077-A Liquid crystal cells DAI NIPPON TORYO KABUSHIKI KAISHA (JA) 1977-02-08 US claimed
US-4005457-A Semiconductor assembly, method of manufacturing same, and bonding agent therefor SEMIMETALS, INC. (US) 1977-01-25 US claimed
US-3985588-A SPINNING MOLD METHOD FOR MAKING PERMANENT MAGNETS CAMBRIDGE THERMIONIC CORPORATION (US) 1976-10-12 US claimed