SCHEMBL10447299

SCHEMBL10447299

Cc1c(O)c(O)c(O)c(O)c1-c1ccccc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SENP1 Q9P0U3 1/20 0.54
PDE4B Q07343 4/20 0.47
PDE4A P27815 3/20 0.47
PDE4C Q08493 3/20 0.47
PDE4D Q08499 3/20 0.47
HDAC4 P56524 1/20 0.45
HDAC2 Q92769 1/20 0.45
HDAC8 Q9BY41 1/20 0.45
HDAC6 Q9UBN7 1/20 0.45
CHEK1 O14757 1/20 0.42
AKT2 P31751 1/20 0.42
BCL2L1 Q07817 2/20 0.41
ALDH1A1 P00352 1/20 0.41
HPGD P15428 1/20 0.41
HSD17B10 Q99714 1/20 0.41
PDCD1 Q15116 1/20 0.41
CD274 Q9NZQ7 1/20 0.41
HNF4A P41235 1/20 0.41
LMNA P02545 2/20 0.39
MAPT P10636 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL28264841 0.94 SENP1 (0.59) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL28248289 0.93 SENP1 (0.58) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL27608966 0.91 SENP1 (0.54) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL27577881 0.88 SENP1 (0.46) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL5589126 0.88 SENP1 (0.58) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL19956058 0.88 PDE4B (0.54) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL19956864 0.86 PDE4B (0.52) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL20982893 0.84 SENP1 (0.52) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL32679359 0.83 PDE4B (0.48) SENP1PDE4BPDE4APDE4CPDE4D
SCHEMBL19956008 0.83 PDE4B (0.41) SENP1PDE4BPDE4APDE4CPDE4D

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0364785-A1 Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board HITACHI, LTD. (JP) 1990-04-25 EP disclosed