Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | CA12 | O43570 | 1/20 | 0.32 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | CA9 | Q16790 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.31 |
| ▸ | TAS2R14 | Q9NYV8 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.31 |
| ▸ | MAPT | P10636 | 2/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.31 |
| ▸ | ATM | Q13315 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | HTT | P42858 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.30 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6828320 | 0.84 | ALDH1A1 (0.43) | CA12CA1CA2CA9KDM4E | |
| SCHEMBL9027781 | 0.82 | CA1 (0.39) | CA12CA1CA2CA9KDM4E | |
| SCHEMBL372707 | 0.78 | PRNP (0.40) | ALDH1A1LMNAMEN1KMT2AALOX15 | |
| SCHEMBL29403670 | 0.78 | AKR1C3 (0.47) | ALDH1A1MAPTHSP90AA1ATM | |
| SCHEMBL6828127 | 0.75 | LMNA (0.44) | CA12CA1CA2CA9KDM4E | |
| SCHEMBL16952259 | 0.74 | ALDH1A1 (0.34) | ALDH1A1 | |
| SCHEMBL16961865 | 0.72 | ALDH1A1 (0.46) | ALDH1A1LMNAMEN1KMT2A | |
| SCHEMBL21668675 | 0.71 | ALDH1A1 (0.41) | CA12CA1CA2CA9KDM4E | |
| SCHEMBL16953214 | 0.71 | ALDH1A1 (0.32) | ALDH1A1 | |
| SCHEMBL29003971 | 0.71 | LMNA (0.46) | CYP1A2CA12CA1CA2CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0364785-A1 | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board | HITACHI, LTD. (JP) | 1990-04-25 | — | — | EP | disclosed |