⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL505727 | 0.81 | ALDH1A1 (0.35) | — | |
| SCHEMBL6661203 | 0.75 | ALDH1A1 (0.32) | — | |
| SCHEMBL97132 | 0.75 | — | — | |
| SCHEMBL9592948 | 0.75 | ALDH1A1 (0.32) | — | |
| SCHEMBL11559117 | 0.75 | — | — | |
| SCHEMBL23838528 | 0.73 | — | — | |
| SCHEMBL6722313 | 0.73 | GRIA1 (0.35) | — | |
| SCHEMBL9720442 | 0.73 | GRIA1 (0.35) | — | |
| SCHEMBL1484286 | 0.73 | — | — | |
| SCHEMBL8457986 | 0.73 | GRIA1 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113637329-B | High-biocompatibility photosensitive organic silicon material, preparation method thereof and application thereof in photocuring 3D printing | 广东工业大学 | 2022-06-14 | — | — | CN | claimed |
| CN-113637329-A | High-biocompatibility photosensitive organic silicon material, preparation method thereof and application thereof in photocuring 3D printing | 广东工业大学 | 2021-11-12 | — | — | CN | claimed |
| CN-107868569-A | A kind of metallic paint | 湖南太子化工涂料有限公司 | 2018-04-03 | — | — | CN | claimed |
| CN-113637329-B | High-biocompatibility photosensitive organic silicon material, preparation method thereof and application thereof in photocuring 3D printing | 广东工业大学 | 2022-06-14 | — | — | CN | disclosed |
| US-20220175632-A1 | OIL-IN-WATER EMULSION COSMETIC | SHISEIDO COMPANY, LTD. (JP) | 2022-06-09 | — | — | US | disclosed |
| CN-111386580-B | Conductive particles, compositions, articles, and methods of making conductive particles | 埃卡特有限公司 | 2022-04-22 | — | — | CN | disclosed |
| CN-113637329-A | High-biocompatibility photosensitive organic silicon material, preparation method thereof and application thereof in photocuring 3D printing | 广东工业大学 | 2021-11-12 | — | — | CN | disclosed |
| US-11052030-B2 | Method for manufacturing microemulsion-type cosmetic | SHISEIDO COMPANY, LTD. (JP) | 2021-07-06 | — | — | US | disclosed |
| EP-3357480-B1 | MICROEMULSION-TYPE COSMETIC AND METHOD FOR MANUFACTURING SAME | SHISEIDO CO LTD (JP) | 2020-11-04 | — | — | EP | disclosed |
| CN-107207877-B | Coated pigments, method for the production and use thereof, coating agents and articles | 埃卡特有限公司 | 2020-09-29 | — | — | CN | disclosed |
| CN-111386580-A | Conductive particles, compositions, articles, and methods of making conductive particles | 埃卡特有限公司 | 2020-07-07 | — | — | CN | disclosed |
| US-6815333-B2 | Tri-layer masking architecture for patterning dual damascene interconnects | DOW GLOBAL TECHNOLOGIES INC. | 2004-11-09 | — | — | US | disclosed |
| WO-2004090965-A2 | ORGANOSILICATE RESIN FORMULATION FOR USE IN MICROELECTRONIC DEVICES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2004-10-21 | — | — | WO | disclosed |
| US-6800413-B2 | LOADING/REACTING HYDROPHILIC PYROGENIC SILICA WITH SILYLATING AGENT (METHYLTRICHLOROSILANE), THEN PURIFYING WITH INERT GAS | WACKER-CHEMIE GMBH (DE) | 2004-10-05 | — | — | US | disclosed |
| US-20030219973-A1 | Tri-layer masking architecture for patterning dual damascene interconnects | DOW GLOBAL TECHNOLOGIES LLC | 2003-11-27 | — | — | US | disclosed |
| WO-2003085719-A2 | PROCESS FOR MAKING AIR GAP CONTAINING SEMICONDUCTING DEVICES AND RESULTING SEMICONDUCTING DEVICE | DOW GLOBAL TECHNOLOGIES INC. (US) | 2003-10-16 | — | — | WO | disclosed |
| US-20030138715-A1 | Low-silanol silica | WACKER-CHEMIE GMBH (DE) | 2003-07-24 | — | — | US | disclosed |
| EP-1314193-A2 | ORGANOSILICATE RESINS AS HARDMASKS FOR ORGANIC POLYMER DIELECTRICS IN FABRICATION OF MICROELECTRONIC DEVICES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2003-05-28 | — | — | EP | disclosed |
| US-20020052125-A1 | Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices | DOW BELGIUM N.V. (BE) | 2002-05-02 | — | — | US | disclosed |
| WO-2002016477-A2 | ORGANOSILICATE RESINS AS HARDMASKS FOR ORGANIC POLYMER DIELECTRICS IN FABRICATION OF MICROELECTRONIC DEVICES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2002-02-28 | — | — | WO | disclosed |