SCHEMBL10535931

SCHEMBL10535931

CCCCCC(=O)N1CCCCCC1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ L3MBTL1 Q9Y468 2/20 1.00
▸ MEN1 O00255 2/20 1.00
▸ KMT2A Q03164 2/20 1.00
▸ TDP1 Q9NUW8 1/20 1.00
▸ ATM Q13315 1/20 0.68
▸ GNAI3 P08754 9/20 0.62
▸ GNAI1 P63096 9/20 0.62
▸ GNAO1 P09471 8/20 0.59
▸ POLB P06746 1/20 0.54
▸ MAPT P10636 1/20 0.54
▸ ALDH1A1 P00352 1/20 0.50
▸ SMN1; SMN2 Q16637 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1492484 1.00 L3MBTL1 (1.00) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL5429229 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
N-(Decanoyl)Hexamethyleneimine SCHEMBL5693872 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL10535945 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL472844 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL24073266 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL14879630 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL1407232 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL3752269 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM
SCHEMBL3984611 0.98 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111448257-B Polyamide resin composition UBE株式会社 2023-08-01 — — CN claimed
CN-116670210-A Material for molded article in contact with high-pressure gas UBE株式会社 2023-08-29 — — CN disclosed
CN-115702187-A Curing rate control with wetting fillers PRC-迪索托国际公司 2023-02-14 — — CN disclosed
CN-107432060-A The manufacture method of encapsulating material, the manufacture method of encapsulating material and light-emitting device 日本瑞翁株式会社 2017-12-01 — — CN disclosed
CN-101906117-B Alkyl phosphinate polymer and preparation method and application thereof YE JINBIAO 2013-01-09 — — CN disclosed
CN-101213252-B Resin composition NIPPON ZEON CO 2012-01-11 — — CN disclosed
CN-101906117-A Alkyl phosphinate polymer and preparation method and application thereof JINBIAO YE 2010-12-08 — — CN disclosed
CN-101213252-A Resin composition ZEON CORP (JP) 2008-07-02 — — CN disclosed
CN-1205027-C Laminated packaging material and process for producing the same KUREHA CHEMICAL IND CO LTD (JP) 2005-06-08 — — CN disclosed
CN-1283150-A Laminated packaging material and process for producing the same KUREHA CHEMICAL IND CO LTD (JP) 2001-02-07 — — CN disclosed
US-4837026-A Transdermal and systemic preparation and method THERAPEUTIC PATCH RESEARCH N.V. 1989-06-06 — — US disclosed
EP-0240554-A1 TRANSDERMAL AND SYSTEMIC PREPARATION AND METHOD RAJADHYAKSHA, Vithal J. (US) 1987-10-14 — — EP disclosed
WO-1987001935-A1 TRANSDERMAL AND SYSTEMIC PREPARATION AND METHOD RAJADHYAKSHA VITHAL J 1987-04-09 — — WO disclosed
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