Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GPR174 | Q9BXC1 | 1/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.47 |
| ▸ | HPGD | P15428 | 2/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.46 |
| ▸ | MEN1 | O00255 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | MAPT | P10636 | 3/20 | 0.44 |
| ▸ | GAA | P10253 | 1/20 | 0.44 |
| ▸ | RAB9A | P51151 | 2/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.43 |
| ▸ | NPC1 | O15118 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1055547 | 0.93 | KDM4E (0.53) | GPR174KDM4EALDH1A1KMT2AMEN1 | |
| SCHEMBL30728601 | 0.86 | KDM4E (0.46) | GPR174KDM4EALDH1A1KMT2AMEN1 | |
| SCHEMBL1055253 | 0.85 | KDM4E (0.49) | GPR174KDM4EALDH1A1HPGDKMT2A | |
| SCHEMBL729505 | 0.83 | KDM4E (0.50) | GPR174KDM4EALDH1A1HPGDKMT2A | |
| SCHEMBL13327253 | 0.82 | HTT (0.44) | GPR174KDM4EALDH1A1KMT2AMEN1 | |
| SCHEMBL10508064 | 0.81 | KDM4E (0.50) | KDM4EALDH1A1HPGDKMT2AMEN1 | |
| SCHEMBL12281700 | 0.80 | KDM4E (0.48) | GPR174KDM4EALDH1A1KMT2AMEN1 | |
| SCHEMBL1056588 | 0.77 | KDM4E (0.55) | KDM4EALDH1A1KMT2AMEN1LMNA | |
| SCHEMBL15096895 | 0.75 | KDM4E (0.39) | KDM4EALDH1A1HPGDKMT2AMEN1 | |
| Hydrochloric Acid SCHEMBL27949581 | 0.75 | LMNA (0.53) | ALDH1A1HPGDKMT2AMEN1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025034474-A1 | 3D PRINTED POROUS SUPRAMOLECULAR SORBENTS | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) | 2025-02-13 | — | — | WO | disclosed |
| US-20240199854-A1 | COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM | FUJIFLIM CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| WO-2024057999-A1 | COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2024-03-21 | — | — | WO | disclosed |
| US-20240030030-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | JSR CORPORATION (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20240021429-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | JSR CORPORATION (JP) | 2024-01-18 | — | — | US | disclosed |
| WO-2023032746-A1 | COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| CN-110095941-B | Photosensitive resin composition and method for producing semiconductor element | 东丽株式会社 | 2023-02-17 | — | — | CN | disclosed |
| WO-2022209816-A1 | METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | JSR株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022202402-A1 | SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | JSR株式会社 | 2022-09-29 | — | — | WO | disclosed |
| CN-107077070-B | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | 东丽株式会社 | 2020-06-16 | — | — | CN | disclosed |
| US-8486604-B2 | Positive-type radiation-sensitive composition, cured film, interlayer insulating film, method of forming interlayer insulating film, display device, and siloxane polymer for forming interlayer insulating film | JSR CORPORATION (JP) | 2013-07-16 | — | — | US | disclosed |
| US-20130126860-A1 | THIN FILM TRANSISTOR SUBSTRATE | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-05-23 | — | — | US | disclosed |
| US-20130126860-A1 | THIN FILM TRANSISTOR SUBSTRATE | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-05-23 | — | — | US | disclosed |
| WO-2011126076-A1 | THIN-FILM TRANSISTOR SUBSTRATE | 大日本印刷株式会社 (JP) | 2011-10-13 | — | — | WO | disclosed |
| US-20110008730-A1 | POSITIVE-TYPE RADIATION-SENSITIVE COMPOSITION, CURED FILM, INTERLAYER INSULATING FILM, METHOD OF FORMING INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND SILOXANE POLYMER FOR FORMING INTERLAYER INSULATING FILM | JSR CORPORATION (JP) | 2011-01-13 | — | — | US | disclosed |
| US-7374856-B2 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film | TORAY INDUSTRIES, INC. (JP) | 2008-05-20 | — | — | US | disclosed |
| US-20060115766-A1 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film | TORAY INDUSTRIES, INC. (JP) | 2006-06-01 | — | — | US | disclosed |
| EP-1662322-A2 | Positive type photo-sensitive siloxane composition, curing film formed by the composition and device with the curing film | TORAY INDUSTRIES, INC. (JP) | 2006-05-31 | — | — | EP | disclosed |
| US-6815142-B1 | Method for forming resist pattern, and overlying layer material and semiconductor device used for forming resist pattern | RENESAS TECHNOLOGY CORP. (JP) | 2004-11-09 | — | — | US | disclosed |
| US-6180320-B1 | Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured thereby | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 2001-01-30 | — | — | US | disclosed |