Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.46 |
| ▸ | CDK1 | P06493 | 1/20 | 0.33 |
| ▸ | CCNB1 | P14635 | 1/20 | 0.33 |
| ▸ | MGMT | P16455 | 1/20 | 0.33 |
| ▸ | CCNA2 | P20248 | 1/20 | 0.33 |
| ▸ | CDK2 | P24941 | 1/20 | 0.33 |
| ▸ | CCNA1 | P78396 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.30 |
| ▸ | CA9 | Q16790 | 1/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1195297 | 0.91 | MAPT (0.40) | MAPTMAPK1KDM4E | |
| SCHEMBL10798317 | 0.89 | MAPK1 (0.50) | MAPTMAPK1CDK1CCNB1MGMT | |
| SCHEMBL23181 | 0.86 | MAPK1 (0.55) | MAPTMAPK1CDK1CCNB1MGMT | |
| SCHEMBL10815003 | 0.84 | MAPT (0.47) | MAPTMAPK1CDK1CCNB1MGMT | |
| Hydrogen Sulfide SCHEMBL20395887 | 0.84 | MAPK1 (0.53) | MAPTMAPK1CDK1CCNB1MGMT | |
| SCHEMBL11182506 | 0.83 | MAPT (0.46) | MAPTMAPK1CDK1CCNB1MGMT | |
| SCHEMBL10961266 | 0.83 | MAPT (0.46) | MAPTMAPK1CDK1CCNB1MGMT | |
| SCHEMBL10960929 | 0.83 | MAPT (0.46) | MAPTMAPK1CDK1CCNB1MGMT | |
| SCHEMBL10804391 | 0.81 | MAPT (0.44) | MAPTMAPK1 | |
| SCHEMBL6124831 | 0.81 | MAPT (0.44) | MAPTMAPK1CA9HPGDHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 108 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3442012-B1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | MITSUI CHEMICALS TOHCELLO INC (JP) | 2024-05-08 | — | — | EP | disclosed |
| EP-3439023-B1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | MITSUI CHEMICALS TOHCELLO INC (JP) | 2024-05-01 | — | — | EP | disclosed |
| CN-117716472-A | Adhesive tape | 麦克赛尔株式会社 | 2024-03-15 | — | — | CN | disclosed |
| WO-2024053490-A1 | RESIN COMPOSITION FOR DICING FILM SUBSTRATE, DICING FILM SUBSTRATE, AND DICING FILM | 三井・ダウポリケミカル株式会社 | 2024-03-14 | — | — | WO | disclosed |
| CN-115605556-B | Adhesive laminated film and method for manufacturing electronic device | 三井化学东赛璐株式会社 | 2024-03-12 | — | — | CN | disclosed |
| CN-117063262-A | Resin composition for dicing film substrate, and dicing film | 三井-陶氏聚合化学株式会社 | 2023-11-14 | — | — | CN | disclosed |
| WO-2023176620-A1 | RESIN COMPOSITION FOR BACK GRINDING FILM SUBSTRATE, BACK GRINDING FILM SUBSTRATE, AND BACK GRINDING FILM | 三井・ダウポリケミカル株式会社 | 2023-09-21 | — | — | WO | disclosed |
| US-11747388-B2 | Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus | MITSUI CHEMICALS TOHCELLO, INC. (JP) | 2023-09-05 | — | — | US | disclosed |
| CN-112236469-B | Resin composition for dicing film substrate, and dicing film | 三井—陶氏聚合化学株式会社 | 2023-07-14 | — | — | CN | disclosed |
| CN-110178203-B | Dicing film substrate and dicing film | 三井—陶氏聚合化学株式会社 | 2023-05-23 | — | — | CN | disclosed |
| US-20010023264-A1 | UV-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1128426-A2 | Uv-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2001-08-29 | — | — | EP | disclosed |
| EP-1081758-A1 | Pressure-sensitive adhesive sheets for dicing | NITTO DENKO CORPORATION (JP) | 2001-03-07 | — | — | EP | disclosed |
| EP-0298448-B1 | Radiation-curable adhesive tape | FURUKAWA ELECTRIC CO LTD (JP) | 1994-06-29 | — | — | EP | disclosed |
| US-5300172-A | Applying pressure sensitive adhesive tape on etchable plate, radiating; reduction of adhesive force | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 1994-04-05 | — | — | US | disclosed |
| US-5281473-A | Pick up system useful for semiconductor wafer dicing | FURAKAWA ELECTRIC CO., LTD. (JP) | 1994-01-25 | — | — | US | disclosed |
| EP-0539973-A2 | A surface-protection method during etching | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 1993-05-05 | — | — | EP | disclosed |
| US-5149586-A | Multilayer; acrylic adhesive; isocyanurate, cyanurate, urethane or silicone (metha)acrylate compound | FURUKAWA ELECTRIC CO., LTD. (JP) | 1992-09-22 | — | — | US | disclosed |
| US-4999242-A | For the production of semiconductors wafers, ceramics and glass | FURUKAWA ELECTRIC CO., LTD. (JP) | 1991-03-12 | — | — | US | disclosed |
| EP-0298448-A2 | Radiation-curable adhesive tape | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 1989-01-11 | — | — | EP | disclosed |