SCHEMBL106557

SCHEMBL106557

CCC[Si](OC(C)C)(OC(C)C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylenediamine SCHEMBL756925 0.90
SCHEMBL10789706 0.87 LMNA (0.32)
SCHEMBL14129293 0.87 LMNA (0.32)
SCHEMBL3978689 0.85
SCHEMBL430819 0.84
SCHEMBL6046671 0.84
SCHEMBL108991 0.83 LMNA (0.33)
SCHEMBL2400694 0.81 LMNA (0.36)
SCHEMBL25261552 0.79 LMNA (0.39)
SCHEMBL16238303 0.79 LMNA (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1184 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118318010-A Coupling agents containing silicon and zinc for cellulosic material-polymer composites 阿科玛股份有限公司 2024-07-09 CN claimed
US-20230046062-A1 ANTIMICROBIAL COMPOSITIONS AND METHODS OF USING THEREOF ZEOVATION, INC. 2023-02-16 US claimed
WO-2021113377-A1 ANTIMICROBIAL COMPOSITIONS AND METHODS OF USING THEREOF OHIO STATE INNOVATION FOUNDATION (US) 2021-06-10 WO claimed
EP-3564325-B1 COATING COMPOSITION, COATING FILM, AND COMPOSITE FOR SHIELDING ELECTROMAGNETIC WAVE LG CHEMICAL LTD (KR) 2020-11-04 EP claimed
EP-3564325-A1 COATING COMPOSITION, COATING FILM, AND COMPOSITE FOR SHIELDING ELECTROMAGNETIC WAVE LG Chem, Ltd. (KR) 2019-11-06 EP claimed
EP-2628744-B1 Silicon-containing surface modifier, resist underlayer film composition containing this, and patterning process SHINETSU CHEMICAL CO (JP) 2016-11-30 EP claimed
EP-2628745-B1 Silicon-containing surface modifier, resist lower layer film-forming composition containing the same, and patterning process SHINETSU CHEMICAL CO (JP) 2015-03-25 EP claimed
CN-101917826-B Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD 2013-08-21 CN claimed
US-8344238-B2 Self-cleaning protective coatings for use with photovoltaic cells SOLYNDRA LLC (US) 2013-01-01 US claimed
US-20110000539-A1 Self-cleaning protective coatings for use with photovoltaic cells SOLYNDRA, INC. (US) 2011-01-06 US claimed
EP-1436338-B1 FLUORINATED COPOLYMERS FOR HYDROPHOBIC AND OLOEPHOBIC TREATMENT OF BUILDING MATERIALS DU PONT (US) 2006-05-03 EP claimed
US-6805964-B2 CONTACTING AT LEAST ONE SIDE OF THE METAL FOIL WITH AN INERT SILANE, TITANATE OR ZIRCONATE COMPOUND TO FORM A PROTECTIVE FILM HAVING THICKNESS 0.001 TO 1 MICRON ON THE SURFACE OF THE METAL FOIL NIKKO MATERIALS USA, INC. 2004-10-19 US claimed
EP-1436338-A1 FLUORINATED COPOLYMERS FOR HYDROPHOBIC AND OLOEPHOBIC TREATMENT OF BUILDING MATERIALS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2004-07-14 EP claimed
US-20030178139-A1 Protective coatings for improved tarnish resistance in metal foils NIKKO MATERIALS USA, INC. 2003-09-25 US claimed
US-6589381-B2 Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin GOULD ELECTRONICS, INC. 2003-07-08 US claimed
US-6537675-B1 Protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film GA-TEK, INC. 2003-03-25 US claimed
WO-2002040557-A1 FLUORINATED COPOLYMERS FOR HYDROPHOBIC AND OLOEPHOBIC TREATMENT OF BUILDING MATERIALS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2002-05-23 WO claimed
US-6299721-B1 CONTACTING FIRST SIDE OF METAL FOIL WITH SOLUTION COMPRISING HYDROCARBYLSILANE, WATER, ORGANIC SOLVENT AND TRIAZOLE COMPOUND TO FORM RESIN DUST RESISTANT FILM ON SURFACE OF METAL GOULD ELECTRONICS INCL 2001-10-09 US claimed
US-20010015257-A1 Coatings for improved resin dust resistance NIKKO MATERIALS USA, INC. 2001-08-23 US claimed
EP-1011299-A2 Coatings for improved resin dust resistance GA-TEK Inc. (US) 2000-06-21 EP claimed