Ethylenediamine

Ethylenediamine

SCHEMBL756925

CCC[Si](OC(C)C)(OC(C)C)OC(C)C.NCCN

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D

The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL106557 0.90
SCHEMBL3149548 0.82
SCHEMBL14129293 0.78 LMNA (0.32)
SCHEMBL134513 0.78
SCHEMBL10789706 0.78 LMNA (0.32)
SCHEMBL25974620 0.77 LMNA (0.32)
SCHEMBL3978689 0.76
Hydrochloric Acid SCHEMBL3256846 0.76
SCHEMBL31719613 0.76 NFKB1 (0.33)
SCHEMBL430819 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023145711-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-03 WO disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
EP-3950849-A1 LATENT HEAT STORAGE MATERIAL Kaneka Corporation (JP) 2022-02-09 EP disclosed
US-20220010185-A1 LATENT HEAT STORAGE MATERIAL KANEKA CORPORATION (JP) 2022-01-13 US disclosed
EP-1621568-B1 ORGANIC POLYMER CONTAINING REACTIVE SILICON GROUP KANEKA CORP (JP) 2019-11-13 EP disclosed
EP-3553134-A1 LIQUID RESIN COMPOSITION Kaneka Corporation (JP) 2019-10-16 EP disclosed
US-20190284361-A1 LIQUID RESIN COMPOSITION KANEKA CORPORATION (JP) 2019-09-19 US disclosed
EP-3178872-B1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORP (JP) 2019-06-19 EP disclosed
EP-3398986-A1 MODIFIED SILICONE RESIN FOAM Kaneka Corporation (JP) 2018-11-07 EP disclosed
US-20060247376-A1 Curing composition KANEKA CORPORATION (JP) 2006-11-02 US disclosed
US-20060211821-A1 Organic polymer containing reactive silicon group KANEKA CORPORATION (JP) 2006-09-21 US disclosed
US-20060173121-A1 Curable composition KANEKA CORPORATION (JP) 2006-08-03 US disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
US-20060079645-A1 Curable compositions KANEKA CORPORATION (JP) 2006-04-13 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1630186-A1 CURING COMPOSITION Kaneka Corporation (JP) 2006-03-01 EP disclosed
EP-1621568-A1 ORGANIC POLYMER CONTAINING REACTIVE SILICON GROUP KANEKA CORPORATION (JP) 2006-02-01 EP disclosed
EP-1598402-A1 CURABLE COMPOSITIONS KANEKA CORPORATION (JP) 2005-11-23 EP disclosed