SCHEMBL1069334

SCHEMBL1069334

CCCO[SiH](CCCNC(N)=O)OCCC

nearest known ligand 0.40

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ACHE P22303 14/20 0.38
EPHX1 P07099 3/20 0.34
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA9 Q16790 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL432323 0.86 CA12 (0.34) ACHEEPHX1CA12CA1CA2
SCHEMBL483443 0.81 CA12 (0.37) ACHEEPHX1CA12CA1CA2
SCHEMBL4885729 0.80 MEN1 (0.37) ACHE
SCHEMBL14081541 0.78 EPHX1 (0.34) ACHEEPHX1
SCHEMBL978491 0.75 TSHR (0.40)
SCHEMBL2108839 0.74 ALOX15 (0.33)
SCHEMBL15019063 0.74 EPHX2 (0.43) ACHE
SCHEMBL1142965 0.74 ACHE (0.39) ACHEEPHX1
SCHEMBL28907172 0.74 CA12 (0.33) ACHEEPHX1CA12CA1CA2
SCHEMBL6708449 0.74 TSHR (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2147041-A2 METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL Momentive Performance Materials Inc. (US) 2010-01-27 EP claimed
WO-2008133916-A2 METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-11-06 WO claimed
US-20080268162-A1 Method of applying an anti-corrosion and/or adhesion promoting coating to a metal and resulting coated metal MOMENTIVE PERFORMANCE MATERIALS INC. 2008-10-30 US claimed
CN-110941142-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-05-25 CN disclosed
CN-110941142-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2020-03-31 CN disclosed
CN-106104381-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2019-12-13 CN disclosed
EP-2147041-B1 METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL MOMENTIVE PERFORMANCE MAT INC (US) 2017-08-23 EP disclosed
US-8501314-B2 Method of applying an anti-corrosion and/or adhesion promoting coating to a metal and resulting coated metal MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2013-08-06 US disclosed
US-20110111212-A1 Method of Applying An Anti-Corrosion And/Or Adhesion Promoting Coating To A Metal And Resulting Coated Metal MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-05-12 US disclosed
US-7875318-B2 Hydrolyzing partially or completely hydrolyzed silane possessing one or more hydroxyl groups; bis-(hydroxyethyl)aminopropyltriethoxysilane; chromium free; nontoxic; environmentally friendly MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-01-25 US disclosed
EP-2147041-A2 METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL Momentive Performance Materials Inc. (US) 2010-01-27 EP disclosed
WO-2008133916-A2 METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-11-06 WO disclosed
US-20080268162-A1 Method of applying an anti-corrosion and/or adhesion promoting coating to a metal and resulting coated metal MOMENTIVE PERFORMANCE MATERIALS INC. 2008-10-30 US disclosed