SCHEMBL10698398

SCHEMBL10698398

CCC[C]1CCCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16597953 0.93
SCHEMBL10696412 0.86 CA1 (0.34)
SCHEMBL2906315 0.85
SCHEMBL10699085 0.85 MEN1 (0.37)
SCHEMBL27840603 0.81 CCR5 (0.36)
SCHEMBL9182386 0.80
SCHEMBL12615012 0.79
SCHEMBL10696277 0.77 MEN1 (0.34)
SCHEMBL27973280 0.73 CA1 (0.34)
SCHEMBL498616 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115024023-A Sealing agent for organic EL display element 积水化学工业株式会社 2022-09-06 CN claimed
CN-109564371-B Polymerizable compound, sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element 积水化学工业株式会社 2021-09-14 CN claimed
US-9029438-B2 Thermosetting resin composition, B-stage heat conductive sheet, and power module MITSUBISHI ELECTRIC CORPORATION (JP) 2015-05-12 US claimed
US-20130012621-A1 THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE MITSUBISHI ELECTRIC CORPORATION (JP) 2013-01-10 US claimed
EP-0253767-A1 Parasiticide and insecticide CIBA-GEIGY AG (CH) 1988-01-20 EP claimed
CN-115024023-A Sealing agent for organic EL display element 积水化学工业株式会社 2022-09-06 CN disclosed
CN-109564371-B Polymerizable compound, sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element 积水化学工业株式会社 2021-09-14 CN disclosed
CN-109564371-B Polymerizable compound, sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element 积水化学工业株式会社 2021-09-14 CN disclosed
WO-2018110552-A1 POLYMERIZABLE COMPOUND, SEALANT FOR LIQUID CRYSTAL DISPLAY ELEMENT, VERTICAL CONDUCTION MATERIAL, AND LIQUID CRYSTAL DISPLAY ELEMENT 積水化学工業株式会社 2018-06-21 WO disclosed
US-9029438-B2 Thermosetting resin composition, B-stage heat conductive sheet, and power module MITSUBISHI ELECTRIC CORPORATION (JP) 2015-05-12 US disclosed
US-20130012621-A1 THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE MITSUBISHI ELECTRIC CORPORATION (JP) 2013-01-10 US disclosed
EP-0253767-A1 Parasiticide and insecticide CIBA-GEIGY AG (CH) 1988-01-20 EP disclosed