⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10734667 | 0.78 | — | — | |
| SCHEMBL16069914 | 0.73 | — | — | |
| SCHEMBL14045218 | 0.72 | LMNA (0.38) | — | |
| SCHEMBL28419426 | 0.72 | CES2 (0.48) | — | |
| SCHEMBL14611135 | 0.71 | — | — | |
| SCHEMBL11288198 | 0.71 | CES2 (0.50) | — | |
| SCHEMBL14684260 | 0.70 | — | — | |
| SCHEMBL20232399 | 0.69 | — | — | |
| SCHEMBL734443 | 0.69 | — | — | |
| SCHEMBL389016 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1686990-B1 | 2-GUANIDINYLIMIDAZOLIDINEDIONE COMPOUNDS AND METHODS OF MAKING AND USING THEREOF | US ARMY MED RES MAT COMMAND (US) | 2012-09-19 | — | — | EP | claimed |
| EP-1686990-A4 | 2-GUANIDINYLIMIDAZOLIDINEDIONE COMPOUNDS AND METHODS OF MAKING AND USING THEREOF | US ARMY MED RES MAT COMMAND (US) | 2009-06-03 | — | — | EP | claimed |
| EP-1686990-A2 | 2-GUANIDINYLIMIDAZOLIDINEDIONE COMPOUNDS AND METHODS OF MAKING AND USING THEREOF | U.S. Army Medical Research and Materiel Command (US) | 2006-08-09 | — | — | EP | claimed |
| WO-2005072082-A2 | 2-GUANIDINYLIMIDAZOLIDINEDIONE COMPOUNDS AND METHODS OF MAKING AND USING THEREOF | U.S. ARMY MEDICAL RESEARCH AND MATERIEL COMMAND (US) | 2005-08-11 | — | — | WO | claimed |
| JP-10237077-A | — | — | None | — | — | JP | disclosed |
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-23 | — | — | US | disclosed |
| WO-2025121026-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2025-06-12 | — | — | WO | disclosed |
| CN-119894957-A | Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device | 旭化成株式会社 | 2025-04-25 | — | — | CN | disclosed |
| WO-2025009354-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | 旭化成株式会社 | 2025-01-09 | — | — | WO | disclosed |
| US-20240301176-A1 | EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR USING ADHESIVE FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-09-12 | — | — | US | disclosed |
| CN-117377552-B | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-118055862-A | Silica reinforced rubber compositions and articles made therefrom | 迈图高新材料公司 | 2024-05-17 | — | — | CN | disclosed |
| US-20080050596-A1 | Flame-Retardant Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2008-02-28 | — | — | US | disclosed |
| EP-1867672-A1 | EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-12-19 | — | — | EP | disclosed |
| CN-1989203-A | Flame-retardant epoxy resin composition | ASAHI CHEMICAL CORP (JP) | 2007-06-27 | — | — | CN | disclosed |
| EP-1775321-A1 | FLAME-RETARDANT EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-04-18 | — | — | EP | disclosed |
| CN-1177829-C | Substituted sulphonyl cyanamides, method for the production thereof and their use as medicaments | ���ĵ�˹ҩ��¹�����˾ | 2004-12-01 | — | — | CN | disclosed |
| CN-1305463-A | Substituted sulphonyl cyanamides, method for the production thereof and their use as medicaments | AVENTIS PHARMA GMBH (DE) | 2001-07-25 | — | — | CN | disclosed |
| JP-H10237077-A | HETEROARYL-SUBSTITUTED PROPIONYL GUANIDINE DERIVATIVE | YAMANOUCHI PHARMACEUT CO LTD | 1998-09-08 | — | — | JP | disclosed |
| US-4833204-A | Epoxy resin composition for a copper-clad laminate | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1989-05-23 | — | — | US | disclosed |