Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.31 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12256492 | 0.82 | CA1 (0.32) | CA1CA2 | |
| SCHEMBL2230410 | 0.80 | CA1 (0.31) | CA1CA2 | |
| SCHEMBL2231399 | 0.80 | CA1 (0.31) | CA1CA2 | |
| SCHEMBL107195 | 0.80 | — | — | |
| SCHEMBL2229445 | 0.80 | CA1 (0.31) | CA1CA2 | |
| SCHEMBL2232849 | 0.78 | CA2 (0.46) | CA1CA2EPHX1PTPN1 | |
| SCHEMBL4457449 | 0.77 | CA2 (0.56) | CA1CA2EPHX1PTPN1 | |
| SCHEMBL37874 | 0.77 | CA2 (0.56) | CA1CA2EPHX1PTPN1 | |
| SCHEMBL10233776 | 0.76 | CA2 (0.40) | CA1CA2EPHX1PTPN1 | |
| SCHEMBL2230692 | 0.75 | CA2 (0.43) | CA1CA2EPHX1PTPN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20160313645-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-10-27 | — | — | US | disclosed |
| US-9116437-B2 | Pattern forming method, chemical amplification resist composition and resist film | FUJIFILM CORPORATION (JP) | 2015-08-25 | — | — | US | disclosed |
| US-9046773-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method using the same, polymerizable compound and polymer compound obtained by polymerizing the polymerizable compound | FUJIFILM CORPORATION (JP) | 2015-06-02 | — | — | US | disclosed |
| US-9017917-B2 | Resist composition and method of forming pattern therewith | FUJIFILM CORPORATION (JP) | 2015-04-28 | — | — | US | disclosed |
| US-8936674-B2 | Conductive silica sol composition, and molded article produced using the same | MITSUBISHI MATERIALS CORPORATION (JP) | 2015-01-20 | — | — | US | disclosed |
| US-8450041-B2 | Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the same | FUJIFILM CORPORATION (JP) | 2013-05-28 | — | — | US | disclosed |
| US-8426101-B2 | Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition | FUJIFILM CORPORATION (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8182975-B2 | Positive resist composition and pattern forming method using the same | FUJIFILM CORPORATION (JP) | 2012-05-22 | — | — | US | disclosed |
| US-8148044-B2 | Positive photosensitive composition | FUJIFILM CORPORATION (JP) | 2012-04-03 | — | — | US | disclosed |
| US-20120058427-A1 | PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| US-20090280440-A1 | SURFACE TREATING AGENT FOR RESIST-PATTERN, AND PATTERN-FORMING METHOD USING SAME | FUJIFILM CORPORATION (JP) | 2009-11-12 | — | — | US | disclosed |
| US-20090246695-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE SAME, POLYMERIZABLE COMPOUND AND POLYMER COMPOUND OBTAINED BY POLYMERIZING THE POLYMERIZABLE COMPOUND | FUJIFILM CORPORATION (JP) | 2009-10-01 | — | — | US | disclosed |
| US-20090246685-A1 | POSITIVE RESIST COMPOSITION FOR ELECTRON BEAM, X-RAY OR EUV AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2009-10-01 | — | — | US | disclosed |
| US-20090087784-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2009-04-02 | — | — | US | disclosed |
| US-20090087776-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2009-04-02 | — | — | US | disclosed |
| US-20090035692-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING MEHTOD | FUJIFILM CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20090017400-A1 | PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2009-01-15 | — | — | US | disclosed |
| US-20080292989-A1 | POSITIVE WORKING PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-11-27 | — | — | US | disclosed |
| US-20080248419-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-20070141512-A1 | Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition | FUJIFILM CORPORATION (JP) | 2007-06-21 | — | — | US | disclosed |