Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.31 |
| ▸ | CA2 | P00918 | 2/20 | 0.31 |
| ▸ | MMP1 | P03956 | 1/20 | 0.30 |
| ▸ | MMP2 | P08253 | 1/20 | 0.30 |
| ▸ | MMP9 | P14780 | 1/20 | 0.30 |
| ▸ | MMP8 | P22894 | 1/20 | 0.30 |
| ▸ | MMP13 | P45452 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12256492 | 0.98 | CA1 (0.32) | CA1CA2MMP1MMP2MMP9 | |
| SCHEMBL2229445 | 0.96 | CA1 (0.31) | CA1CA2MMP1MMP2MMP9 | |
| SCHEMBL2230410 | 0.96 | CA1 (0.31) | CA1CA2MMP1MMP2MMP9 | |
| SCHEMBL14706304 | 0.85 | CA1 (0.38) | CA1CA2MMP1MMP2MMP9 | |
| SCHEMBL107265 | 0.80 | CA1 (0.37) | CA1CA2 | |
| SCHEMBL107195 | 0.78 | — | — | |
| SCHEMBL2231402 | 0.77 | CA1 (0.42) | CA1CA2MMP1MMP2MMP9 | |
| SCHEMBL13241447 | 0.75 | CA1 (0.35) | CA1CA2 | |
| SCHEMBL2231717 | 0.74 | CA1 (0.43) | CA1CA2MMP1MMP2MMP9 | |
| SCHEMBL2233597 | 0.72 | CA1 (0.42) | CA1CA2MMP1MMP2MMP9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8936674-B2 | Conductive silica sol composition, and molded article produced using the same | MITSUBISHI MATERIALS CORPORATION (JP) | 2015-01-20 | — | — | US | disclosed |
| US-20110210295-A1 | Conductive silica sol composition, and molded article produced using the same | MITSUBISHI MATERIALS CORPORATION (JP) | 2011-09-01 | — | — | US | disclosed |
| EP-2354206-A1 | ELECTRICALLY CONDUCTIVE SILICA SOL COMPOSITION AND MOLDED ARTICLE PRODUCED BY USING SAME | Mitsubishi Materials Corporation (JP) | 2011-08-10 | — | — | EP | disclosed |