SCHEMBL107648

SCHEMBL107648

Nc1ccc(C(=O)Oc2ccc(-c3cc(N)ccc3C(=O)O)cc2)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.49
F2 P00734 3/20 0.49
PRSS1 P07477 3/20 0.49
PRSS2 P07478 3/20 0.49
PRSS3 P35030 3/20 0.49
PKM P14618 3/20 0.49
MAPT P10636 6/20 0.47
CYP3A4 P08684 3/20 0.47
SMN1; SMN2 Q16637 3/20 0.47
TP53 P04637 2/20 0.47
KDR P35968 2/20 0.47
LMNA P02545 1/20 0.47
ADORA3 P0DMS8 1/20 0.47
CHRM1 P11229 1/20 0.47
TBXA2R P21731 1/20 0.47
SLC6A2 P23975 1/20 0.47
PDE4A P27815 1/20 0.47
ADRA1A P35348 1/20 0.47
SLC6A3 Q01959 1/20 0.47
HDAC6 Q9UBN7 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15952343 0.91 NR1H4 (0.46) KMT2AF2PRSS1PRSS2PRSS3
SCHEMBL107412 0.85 MAPT (0.47) KMT2AF2PRSS1PRSS2PRSS3
SCHEMBL30877944 0.84 PRSS1 (0.52) KMT2AF2PRSS1PRSS2PRSS3
SCHEMBL6443680 0.83 ALDH1A1 (0.57) KMT2APKMMAPTCYP3A4SMN1; SMN2
SCHEMBL28284951 0.82 KDM4E (0.49) KMT2APKMMAPTCYP3A4KDR
SCHEMBL28692920 0.82 HSD17B10 (0.51) KMT2APKMMAPTSMN1; SMN2TP53
SCHEMBL31402588 0.82 HSD17B10 (0.51) KMT2APKMMAPTSMN1; SMN2TP53
SCHEMBL29626098 0.82 KDM4E (0.59) KMT2APKMMAPTCYP3A4SMN1; SMN2
SCHEMBL1683894 0.82 KDM4E (0.59) KMT2APKMMAPTCYP3A4SMN1; SMN2
SCHEMBL22826550 0.81 MAPT (0.61) KMT2AF2PRSS1PRSS2PRSS3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 124 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025105900-A1 LOW DIELECTRIC POLYIMIDE FILM USING MONOMER HAVING ESTER GROUP AND MANUFACTURING METHOD THEREOF 피아이첨단소재 주식회사 2025-05-22 WO claimed
WO-2024207567-A1 RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD, AND RELATED PRODUCT 瑞声科技(南京)有限公司 2024-10-10 WO claimed
CN-118271610-A Polyamic acid slurry for optical fiber and preparation method and application thereof 宁波博雅聚力新材料科技有限公司 2024-07-02 CN claimed
CN-118221936-A High-performance preparation method and application of polyimide 中国科学院化学研究所 2024-06-21 CN claimed
CN-118027402-A Corona-resistant polyimide, preparation method thereof and insulated wire 深圳市摩码克来沃化学科技有限公司 2024-05-14 CN claimed
CN-118027395-A Coating material, preparation method and application thereof, and lithium battery diaphragm 安徽壹石通材料科学研究院有限公司 2024-05-14 CN claimed
CN-117964895-A High-temperature-resistant transparent polyimide, polyimide film and preparation method thereof 华为技术有限公司 2024-05-03 CN claimed
CN-117624598-A VA type polyimide liquid crystal aligning agent, preparation method and application thereof 烟台显华高分子材料有限公司 2024-03-01 CN claimed
CN-116925352-A High-transparency low-yellowing high-performance polyamide acid resin and preparation method of polyimide film 山东理工大学 2023-10-24 CN claimed
CN-116496623-A Resin composition, polyimide preparation method and related products 瑞声科技(南京)有限公司 2023-07-28 CN claimed
CN-116333310-A TPI resin and preparation method and application thereof 广州方邦电子股份有限公司 2023-06-27 CN claimed
US-20210087319-A1 POLYIMIDE FILM, BLOCK COPOLYMER OF POLYAMIDE ACID, AND METHOD FOR MANUFACTURING THE BLOCK COPOLYMER OF POLYAMIDE ACID Zhen Ding Technology Co., Ltd. (TW) 2021-03-25 US claimed
US-20250215153-A1 POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE UBE CORPORATION (JP) 2025-07-03 US disclosed
US-20250206883-A1 POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE UBE CORPORATION (JP) 2025-06-26 US disclosed
US-12313227-B2 LED filament and LED light bulb ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD. (CN) 2025-05-27 US disclosed
WO-2025105900-A1 LOW DIELECTRIC POLYIMIDE FILM USING MONOMER HAVING ESTER GROUP AND MANUFACTURING METHOD THEREOF 피아이첨단소재 주식회사 2025-05-22 WO disclosed
US-20120097435-A1 PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF PI R&D CO., LTD. (JP) 2012-04-26 US disclosed
EP-2431400-A2 MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE PI R & D Co. Ltd (JP) 2012-03-21 EP disclosed
EP-2426557-A1 PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF PI R & D Co. Ltd (JP) 2012-03-07 EP disclosed
US-20110305863-A1 THERMOPLASTIC RESIN COMPOSITION THE YOKOHAMA RUBBER CO., LTD. (JP) 2011-12-15 US disclosed