SCHEMBL107412

SCHEMBL107412

Nc1ccc(C(=O)Oc2cccc(-c3cc(N)ccc3C(=O)O)c2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.47
CYP3A4 P08684 2/20 0.47
LMNA P02545 1/20 0.47
TP53 P04637 1/20 0.47
ADORA3 P0DMS8 1/20 0.47
CHRM1 P11229 1/20 0.47
TBXA2R P21731 1/20 0.47
SLC6A2 P23975 1/20 0.47
PDE4A P27815 1/20 0.47
ADRA1A P35348 1/20 0.47
KDR P35968 1/20 0.47
SLC6A3 Q01959 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
HDAC6 Q9UBN7 1/20 0.47
NR1H4 Q96RI1 1/20 0.42
MAOA P21397 1/20 0.42
MAOB P27338 1/20 0.42
ALOX5 P09917 1/20 0.41
PRSS1 P07477 4/20 0.40
F2 P00734 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17744877 0.86 NR1H4 (0.41) MAPTCYP3A4LMNATP53ADORA3
SCHEMBL107648 0.85 KMT2A (0.49) MAPTCYP3A4LMNATP53ADORA3
SCHEMBL17744788 0.81 NR1H4 (0.41) MAPTCYP3A4LMNATP53ADORA3
SCHEMBL1683900 0.80 ALDH1A1 (0.53) MAPTCYP3A4KDRMAOAKMT2A
SCHEMBL30014006 0.80 ALDH1A1 (0.53) MAPTCYP3A4KDRMAOAKMT2A
SCHEMBL6864415 0.80 MAOA (0.51) MAPTSLC6A3MAOAMAOBALOX5
SCHEMBL9185619 0.79 NR1H4 (0.54) MAPTCYP3A4LMNATP53ADORA3
SCHEMBL9185623 0.79 MCL1 (0.58) MAPTCYP3A4KDRMAOAKMT2A
SCHEMBL107413 0.79 NR1H4 (0.56) MAPTCYP3A4LMNATP53ADORA3
SCHEMBL17744790 0.78 MAPT (0.41) MAPTCYP3A4LMNATP53ADORA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107207749-B Bonding of composite materials 塞特工业公司 2021-03-16 CN claimed
EP-3227363-B1 BONDING OF COMPOSITE MATERIALS CYTEC IND INC (US) 2020-10-07 EP claimed
US-10119001-B2 Extended room temperature storage of epoxy resins HEXCEL CORPORATION (US) 2018-11-06 US claimed
EP-3114153-B1 EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS HEXCEL CORP (US) 2017-11-29 EP claimed
US-9789646-B2 Bonding of composite materials CYTEC INDUSTRIES INC. (US) 2017-10-17 US claimed
EP-3227363-A1 BONDING OF COMPOSITE MATERIALS Cytec Industries Inc. (US) 2017-10-11 EP claimed
WO-2016073192-A1 BONDING OF COMPOSITE MATERIALS CYTEC INDUSTRIES INC. (US) 2016-05-12 WO claimed
US-20160121591-A1 BONDING OF COMPOSITE MATERIALS CYTEC INDUSTRIES INC. (US) 2016-05-05 US claimed
US-20150252182-A1 EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS HEXCEL CORPORATION (US) 2015-09-10 US claimed
US-20250230328-A1 POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME PI ADVANCED MATERIALS CO., LTD (KR) 2025-07-17 US disclosed
US-20250019541-A1 POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME PI ADVANCED MATERIALS CO., LTD (KR) 2025-01-16 US disclosed
US-20240417592-A1 POLYIMIDE COATING MATERIAL PI ADVANCED MATERIALS CO., LTD. (KR) 2024-12-19 US disclosed
US-20240318034-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE COATING MATERIAL COMPRISING SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-09-26 US disclosed
EP-4424763-A1 POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME PI Advanced Materials Co., Ltd. (KR) 2024-09-04 EP disclosed
US-8859170-B2 Photosensitive modified polyimide resin composition and use thereof PI R&D CO., LTD. (JP) 2014-10-14 US disclosed
US-8779085-B2 Modified polyimide and method for producing modified polyimide PI R&D CO., LTD. (JP) 2014-07-15 US disclosed
US-20120097435-A1 PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF PI R&D CO., LTD. (JP) 2012-04-26 US disclosed
US-20120097439-A1 MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE PI R&D CO., LTD. (JP) 2012-04-26 US disclosed
EP-2431400-A2 MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE PI R & D Co. Ltd (JP) 2012-03-21 EP disclosed
EP-2426557-A1 PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF PI R & D Co. Ltd (JP) 2012-03-07 EP disclosed