⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2221057 | 0.89 | — | — | |
| SCHEMBL28022191 | 0.86 | — | — | |
| Hydrochloric Acid SCHEMBL7106585 | 0.84 | — | — | |
| SCHEMBL28477002 | 0.84 | — | — | |
| SCHEMBL8497621 | 0.80 | — | — | |
| SCHEMBL698748 | 0.77 | — | — | |
| SCHEMBL16004803 | 0.71 | — | — | |
| SCHEMBL1055321 | 0.69 | — | — | |
| SCHEMBL5712009 | 0.69 | ALDH1A1 (0.30) | — | |
| SCHEMBL16004913 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4240433-B1 | MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | ELKEM SILICONES SHANGHAI CO LTD (CN) | 2025-12-24 | — | — | EP | disclosed |
| US-20250352692-A1 | MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | ELKEM SILICONES FRANCE SAS (FR) | 2025-11-20 | — | — | US | disclosed |
| US-12453800-B2 | Medical silicone pressure-sensitive adhesive composition | ELKEM SILICONES SHANGHAI CO., LTD. (CN) | 2025-10-28 | — | — | US | disclosed |
| CN-119213094-A | Medical silicone pressure sensitive adhesive composition | 埃肯有机硅法国简易股份公司 | 2024-12-27 | — | — | CN | disclosed |
| US-20240009343-A1 | MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | ELKEM SILICONES FRANCE SAS (FR) | 2024-01-11 | — | — | US | disclosed |
| CN-117157112-A | Medical silicone pressure sensitive adhesive composition | 埃肯有机硅（上海）有限公司 | 2023-12-01 | — | — | CN | disclosed |
| WO-2023213430-A1 | MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | ELKEM SILICONES FRANCE SAS (FR) | 2023-11-09 | — | — | WO | disclosed |
| EP-4273204-A1 | MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | ELKEM SILICONES France SAS (FR) | 2023-11-08 | — | — | EP | disclosed |
| CN-116782890-A | Patch coated with capsaicin-containing silicone gel | 埃肯有机硅（上海）有限公司 | 2023-09-19 | — | — | CN | disclosed |
| EP-4240433-A1 | MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | Elkem Silicones Shanghai Co., Ltd. (CN) | 2023-09-13 | — | — | EP | disclosed |
| EP-1931613-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FujiFilm Electronic Materials USA, Inc. (US) | 2008-06-18 | — | — | EP | disclosed |
| EP-1931746-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FujiFilm Electronic Materials USA, Inc. (US) | 2008-06-18 | — | — | EP | disclosed |
| WO-2007033123-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2007-03-22 | — | — | WO | disclosed |
| WO-2007033075-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2007-03-22 | — | — | WO | disclosed |
| US-20070057235-A1 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-03-15 | — | — | US | disclosed |
| US-20070057234-A1 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-03-15 | — | — | US | disclosed |
| US-20030035917-A1 | Image making medium | HYMAN SYDNEY (US) | 2003-02-20 | — | — | US | disclosed |
| US-6506537-B2 | Photopolymerization | JSR CORPORATION (JP) | 2003-01-14 | — | — | US | disclosed |
| US-20020012872-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-31 | — | — | US | disclosed |
| EP-1164433-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |