Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CALM1 | P0DP23 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | BCL2 | P10415 | 1/20 | 0.33 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.33 |
| ▸ | LTA4H | P09960 | 1/20 | 0.32 |
| ▸ | IDH1 | O75874 | 1/20 | 0.31 |
| ▸ | HTR2A | P28223 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 3/20 | 0.31 |
| ▸ | IDO1 | P14902 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | LOXL2 | Q9Y4K0 | 1/20 | 0.31 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | SORT1 | Q99523 | 1/20 | 0.31 |
| ▸ | PLA2G10 | O15496 | 1/20 | 0.31 |
| ▸ | PLA2G2A | P14555 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | ATM | Q13315 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL919191 | 0.79 | — | — | |
| SCHEMBL79754 | 0.76 | CALM1 (0.50) | CALM1KDM4ECYP3A4MAPTBCL2 | |
| SCHEMBL10629127 | 0.76 | CALM1 (0.50) | CALM1KDM4ECYP3A4MAPTBCL2 | |
| SCHEMBL711973 | 0.71 | CALM1 (0.57) | CALM1KDM4ECYP3A4MAPTBCL2 | |
| SCHEMBL9802846 | 0.71 | CALM1 (0.44) | CALM1KDM4ECYP3A4MAPTBCL2 | |
| SCHEMBL2093279 | 0.71 | CALM1 (0.50) | CALM1BCL2BCL2L1LTA4HIDH1 | |
| SCHEMBL8466360 | 0.70 | CALM1 (0.55) | CALM1KDM4ECYP3A4MAPTBCL2 | |
| SCHEMBL1931320 | 0.69 | — | — | |
| SCHEMBL2094181 | 0.68 | CALM1 (0.46) | CALM1KDM4ECYP3A4MAPTBCL2 | |
| SCHEMBL7532413 | 0.68 | CALM1 (0.52) | CALM1BCL2BCL2L1LTA4HIDH1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4100191-A | 4-(M,M'-Di-t-butyl-p-hydroxyphenyl)-butyl-2-diamides | BASF AKTIENGESELLSCHAFT (DE) | 1978-07-11 | — | — | US | claimed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| US-6498227-B1 | COPOLYMER OF AN AROMATIC DICARBOXYLIC ACID, A PHOSPHINIC DICARBOXYLIC ACID AND A DIOL; HALOGEN-FREE; DURABILITY; WASHING AND DRY CLEANING RESISTANCE | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2002-12-24 | — | — | US | disclosed |
| US-6383636-B2 | MOLDING MATERIALS; IMPACT STRENGTH, HEAT RESISTANCE, SOLVENT RESISTANCE | DIRECTOR-GENERAL OF NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, MINISTRY OF ECONOMY, TRADE AND INDUSTRY (JP) | 2002-05-07 | — | — | US | disclosed |
| US-20020007020-A1 | (2,5-disubstituted-1,4-phenylene oxide) block or graft copolymer | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-01-17 | — | — | US | disclosed |
| EP-0716661-B1 | PSEUDO- AND NON-PEPTIDE BRADYKININ RECEPTOR ANTAGONISTS | SCIOS INC (US) | 2000-04-05 | — | — | EP | disclosed |
| US-5817756-A | USING A MODIFIED DI- OR TRI-PEPTIDES | SCIOS INC. (US) | 1998-10-06 | — | — | US | disclosed |
| EP-0716661-A1 | PSEUDO- AND NON-PEPTIDE BRADYKININ RECEPTOR ANTAGONISTS | SCIOS NOVA INC. (US) | 1996-06-19 | — | — | EP | disclosed |
| WO-1995007294-A1 | PSEUDO- AND NON-PEPTIDE BRADYKININ RECEPTOR ANTAGONISTS | SCIOS NOVA INC. (US) | 1995-03-16 | — | — | WO | disclosed |
| US-4104287-A | 4-M,M'-Di-t-butyl-p-hydroxyphenyl) butyl-2 compounds | BASF AKTIENGESELLSCHAFT (DE) | 1978-08-01 | — | — | US | disclosed |
| US-4100191-A | 4-(M,M'-Di-t-butyl-p-hydroxyphenyl)-butyl-2-diamides | BASF AKTIENGESELLSCHAFT (DE) | 1978-07-11 | — | — | US | disclosed |
| US-4026952-A | 4-(M,M'-DI-T-BUTYL-P-HYDROXYPHENYL) BUTYL-2 COMPOUNDS | BASF AKTIENGESELLSCHAFT (DT) | 1977-05-31 | — | — | US | disclosed |