SCHEMBL1088947

SCHEMBL1088947

O=C(O)C=Cc1cccc(C2CCCCC2)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMO O15229 1/20 0.56
NPSR1 Q6W5P4 1/20 0.51
HDAC4 P56524 3/20 0.49
HDAC2 Q92769 3/20 0.49
HDAC8 Q9BY41 3/20 0.49
HDAC3 O15379 2/20 0.49
HDAC1 Q13547 2/20 0.49
HDAC7 Q8WUI4 2/20 0.49
HDAC10 Q969S8 2/20 0.49
HDAC11 Q96DB2 2/20 0.49
HDAC6 Q9UBN7 2/20 0.49
HDAC9 Q9UKV0 2/20 0.49
HDAC5 Q9UQL6 2/20 0.49
TNKS O95271 1/20 0.49
HCAR2 Q8TDS4 1/20 0.49
TNKS2 Q9H2K2 1/20 0.49
PRMT1 Q99873 1/20 0.47
SMN1; SMN2 Q16637 2/20 0.45
MAPT P10636 2/20 0.45
HPGD P15428 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1087827 1.00 KMO (0.56) KMONPSR1HDAC4HDAC2HDAC8
SCHEMBL1088373 0.98 KMO (0.54) KMONPSR1HDAC4HDAC2HDAC8
SCHEMBL28893610 0.87 HTR2C (0.50) NPSR1HDAC4HDAC2HDAC8HDAC3
SCHEMBL1088759 0.81 KMT2A (0.56) HDAC4HDAC2HDAC8HDAC3HDAC1
SCHEMBL11823376 0.81 KMT2A (0.56) HDAC4HDAC2HDAC8HDAC3HDAC1
SCHEMBL1088369 0.81 KMT2A (0.56) HDAC4HDAC2HDAC8HDAC3HDAC1
SCHEMBL11828873 0.81 KMT2A (0.56) HDAC4HDAC2HDAC8HDAC3HDAC1
SCHEMBL1089210 0.79 KMT2A (0.54) HDAC4HDAC2HDAC8HDAC3HDAC1
SCHEMBL11836678 0.79 KMT2A (0.54) HDAC4HDAC2HDAC8HDAC3HDAC1
SCHEMBL11740734 0.79 KMO (0.44) KMONPSR1HDAC4HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed