SCHEMBL10889793

SCHEMBL10889793

O=C1OC(=O)c2c(Oc3ccc(Oc4cccc5c4C(=O)OC5=O)cc3)cccc21

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.43
ALOX15 P16050 1/20 0.43
TYMS P04818 3/20 0.41
ALDH1A1 P00352 4/20 0.39
HPGD P15428 4/20 0.38
KDM4E B2RXH2 2/20 0.38
SMN1; SMN2 Q16637 4/20 0.38
LMNA P02545 2/20 0.37
MAPT P10636 3/20 0.37
NPC1 O15118 2/20 0.37
RAB9A P51151 2/20 0.37
CYP1A2 P05177 1/20 0.37
CYP3A4 P08684 1/20 0.37
CYP2C19 P33261 1/20 0.37
GAPDH P04406 1/20 0.37
NCOA1 Q15788 1/20 0.37
NCOA3 Q9Y6Q9 1/20 0.37
KMT2A Q03164 3/20 0.36
MAPK1 P28482 2/20 0.36
HTT P42858 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31104976 1.00 TDP1 (0.43) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL30930078 0.98 TDP1 (0.41) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL24946583 0.98 TDP1 (0.41) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL22304634 0.95 TDP1 (0.39) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL31019584 0.95 TDP1 (0.39) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL2828512 0.93 ALOX15 (0.45) TDP1ALOX15SMN1; SMN2LMNAMAPT
SCHEMBL31228169 0.90 TDP1 (0.48) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL261809 0.90 TDP1 (0.48) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL31105268 0.89 TDP1 (0.40) TDP1ALOX15TYMSALDH1A1HPGD
SCHEMBL23776321 0.89 TDP1 (0.40) TDP1ALOX15TYMSALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4674897-A1 FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN I.S.T Corporation (JP) 2026-01-07 EP disclosed
WO-2024181294-A1 FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN 株式会社アイ.エス.テイ 2024-09-06 WO disclosed
US-9123689-B2 Epoxy resin composition, method for producing same, and semiconductor device using same TORAY INDUSTRIES, INC. (JP) 2015-09-01 US disclosed
US-20140005318-A1 EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME TORAY INDUSTRIES, INC. (JP) 2014-01-02 US disclosed
EP-0014599-B1 PROCESS FOR THE PRODUCTION OF SILICONES M & T CHEMICALS, INC. (US) 1986-06-04 EP disclosed
EP-0015720-B1 COPOLYMERIC COATING COMPOSITIONS M & T CHEMICALS, INC. (US) 1983-10-12 EP disclosed
US-RE30677-E Silicone containing bis-thioether aromatic amines M&T CHEMICALS INC. (US) 1981-07-14 US disclosed
EP-0015720-A1 Copolymeric coating compositions M & T CHEMICALS, INC. (US) 1980-09-17 EP disclosed
EP-0014599-A2 Process for the production of silicones M & T CHEMICALS, INC. (US) 1980-08-20 EP disclosed
US-4139547-A Silicone containing bis-thioether aromatic amines BERGSTON & ASSOCIATES, INC. (US) 1979-02-13 US disclosed