SCHEMBL1089237

SCHEMBL1089237

CC=C(C(=O)O)C12CCC(C1)C1CCCC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1087710 0.78
SCHEMBL5640800 0.76
SCHEMBL6120122 0.72 PSEN1 (0.32)
SCHEMBL479138 0.70
SCHEMBL16859733 0.70
SCHEMBL10079898 0.69
SCHEMBL653435 0.68
SCHEMBL7251920 0.68 HSD11B1 (0.30)
SCHEMBL1089259 0.67
SCHEMBL479445 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed