⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL479138 | 0.81 | — | — | |
| SCHEMBL16859733 | 0.81 | — | — | |
| SCHEMBL479445 | 0.78 | — | — | |
| SCHEMBL891754 | 0.72 | — | — | |
| SCHEMBL1089237 | 0.67 | — | — | |
| SCHEMBL18294094 | 0.66 | OPRM1 (0.31) | — | |
| Succinic Acid SCHEMBL30944833 | 0.65 | UGT2B7 (0.36) | — | |
| Adipic Acid SCHEMBL30944832 | 0.63 | UGT2B7 (0.39) | — | |
| SCHEMBL701845 | 0.63 | ARG1 (0.32) | — | |
| SCHEMBL1087710 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| US-7416821-B2 | Thermally cured undercoat for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2008-08-26 | — | — | US | disclosed |
| US-20050238997-A1 | Thermally cured undercoat for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2005-10-27 | — | — | US | disclosed |