SCHEMBL1089967

SCHEMBL1089967

COC(=O)C1C2C3C=CC(C3)C12

nearest known ligand 0.37

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ PPM1B O75688 1/20 0.37
▸ PTPN1 P18031 1/20 0.37
▸ PPP1CC P36873 1/20 0.37
▸ SMN1; SMN2 Q16637 3/20 0.37
▸ PKM P14618 1/20 0.37
▸ SLC6A3 Q01959 2/20 0.36
▸ KDM4E B2RXH2 1/20 0.36
▸ MEN1 O00255 2/20 0.35
▸ KMT2A Q03164 2/20 0.35
▸ CYP2C19 P33261 2/20 0.35
▸ CHRNB2 P17787 1/20 0.35
▸ CHRNB4 P30926 1/20 0.35
▸ CHRNA3 P32297 1/20 0.35
▸ CHRNA7 P36544 1/20 0.35
▸ CHRNA4 P43681 1/20 0.35
▸ POLB P06746 2/20 0.35
▸ ALDH1A1 P00352 3/20 0.35
▸ CYP1A2 P05177 1/20 0.35
▸ CYP2C9 P11712 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13902832 0.96 PPM1B (0.37) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL18906482 0.96 PPM1B (0.37) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL3921202 0.96 PPM1B (0.37) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL5732376 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL7197213 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL147771 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL18461270 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL14827588 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL30363373 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM
SCHEMBL28062749 0.86 ALDH1A1 (0.44) PPM1BPTPN1PPP1CCSMN1; SMN2PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 — — US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 — — US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 — — US disclosed
US-7727705-B2 High etch resistant underlayer compositions for multilayer lithographic processes FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2010-06-01 — — US disclosed
WO-2008140846-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-11-20 — — WO disclosed
US-20080206667-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2008-08-28 — — US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 — — US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 — — WO disclosed
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