Phosphoric Acid

Phosphoric Acid

SCHEMBL1090914

O=P(O)(O)O.c1c[nH]cn1

nearest known ligand 0.68

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Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Phosphoric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.68
FKBP5 Q13451 1/20 0.68

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phosphoric Acid SCHEMBL1352614 1.00 ALDH1A1 (0.68) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL27150318 1.00 ALDH1A1 (0.68) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL27850773 1.00 ALDH1A1 (0.68) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL29042477 1.00 ALDH1A1 (0.68) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL22659156 1.00 ALDH1A1 (0.68) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL28278337 0.97 ALDH1A1 (0.65) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL10457918 0.97 ALDH1A1 (0.65) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL31078282 0.97 ALDH1A1 (0.65) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL28559121 0.97 ALDH1A1 (0.65) ALDH1A1FKBP5
Phosphoric Acid SCHEMBL28458512 0.91 ALDH1A1 (0.56) ALDH1A1FKBP5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 422 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121472867-B Aluminum etching solution and preparation method and application thereof 合肥中聚和成光电材料股份有限公司 2026-05-19 CN claimed
CN-122013345-A Wormwood mosquito-proof ultraviolet-resistant chinlon 浙江爬爬婴幼儿用品有限公司 2026-05-12 CN claimed
CN-120059423-A Composite current collector base film with high chemical stability and preparation method thereof 扬州博恒新能源材料科技有限公司 2025-05-30 CN claimed
CN-119082878-B Semi-organic imidazole phosphate nonlinear optical crystal material, preparation and application thereof 同济大学 2025-05-13 CN claimed
CN-119954752-A Preparation method of (S) - (+) -3-hydroxytetrahydrofuran 昊禾生物科技(常州)有限公司 2025-05-09 CN claimed
CN-119795702-A Energy-saving environment-friendly polyarylate fabric whole-core flame-retardant conveying belt and manufacturing method thereof 安徽中意胶带有限责任公司 2025-04-11 CN claimed
CN-119639177-A Preparation method of imidazole phosphate ionic liquid modified epoxy resin composite material 沈阳化工大学 2025-03-18 CN claimed
EP-4512926-A1 A PHOTONIC LAYER DOPED WITH NANOPARTICLES AND A METHOD FOR OBTAINING SAID PHOTONIC LAYER Siec Badawcza Lukasiewicz - PORT Polski Osrodek Rozwoju Technologii (PL) 2025-02-26 EP claimed
CN-116959778-B Use of accelerator and conductive additive in preparing low-temperature conductive copper paste and low-temperature conductive copper paste 隆基绿能科技股份有限公司 2024-12-31 CN claimed
CN-119082878-A Semi-organic imidazole phosphate nonlinear optical crystal material, preparation and application thereof 同济大学 2024-12-06 CN claimed
EP-1818351-A1 Underfill encapsulant for wafer packaging and method for its application National Starch and Chemical Investment Holding Corporation (US) 2007-08-15 EP claimed
CN-101016445-A Underfill encapsulant for wafer packaging and method for its application NAT STARCH CHEM INVEST (US) 2007-08-15 CN claimed
US-20060194064-A1 Underfill encapsulant for wafer packaging and method for its application HENKEL AG & CO. KGAA (DE) 2006-08-31 US claimed
US-20060125119-A1 B-stageable underfill encapsulant and method for its application HENKEL AG & CO. KGAA (DE) 2006-06-15 US claimed
EP-1203782-B1 Imidazole-Phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions AIR PROD & CHEM (US) 2006-02-15 EP claimed
CN-1732225-A Non-flowing toughened epoxy-anhydride underfill encapsulant NAT STARCH CHEM INVEST (US) 2006-02-08 CN claimed
CN-1643682-A No-flow underfill encapsulant NAT STARCH CHEM INVEST (US) 2005-07-20 CN claimed
US-6441064-B1 A HEAT CURABLE, A ONE-COMPONENT EPOXY PROTECTIVE OR DECORATIVE COATING OR ADHESIVE FORMULATION CONTAINING AN EPOXY RESIN, DICYANDIAMIDE LATENT HEAT CURING AGENT AND AN IMIDAZOLE PHOSPHATE SALT ACCELERATOR FOR CURING AGENT AIR PRODUCTS AND CHEMICALS, INC. 2002-08-27 US claimed
CN-1351092-A Midezole-phosphate as accelerator for dicyandiamide in epoxy composition in a separated container AIR PROD & CHEM (US) 2002-05-29 CN claimed
EP-1203782-A1 Imidazole-Phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions AIR PRODUCTS AND CHEMICALS, INC. (US) 2002-05-08 EP claimed