SCHEMBL109214

SCHEMBL109214

Nc1ccccc1C1(c2ccccc2N)c2ccccc2-c2ccccc21

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 3/20 0.56
SMN1; SMN2 Q16637 2/20 0.56
MEN1 O00255 2/20 0.56
MAPT P10636 2/20 0.56
KDM4E B2RXH2 1/20 0.56
LMNA P02545 1/20 0.56
OPRK1 P41145 1/20 0.56
ALDH1A1 P00352 2/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
ALOX15 P16050 2/20 0.43
CYP3A4 P08684 1/20 0.43
CASP1 P29466 1/20 0.43
CASP7 P55210 1/20 0.43
HSD17B10 Q99714 1/20 0.42
PDK2 Q15119 4/20 0.40
ESR1 P03372 1/20 0.37
ESR2 Q92731 1/20 0.37
THRB P10828 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
ADORA2A P29274 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29580288 1.00 KMT2A (0.56) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL8984563 0.88 ALOX15 (0.46) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL9348335 0.86 SMN1; SMN2 (0.52) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL29355276 0.84 KMT2A (0.56) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL44942 0.84 KMT2A (0.56) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL8984849 0.83 SMN1; SMN2 (0.78) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL6138101 0.82 PDK2 (0.49) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL29431837 0.82 PDK2 (0.56) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL15505765 0.82 PDK2 (0.56) KMT2ASMN1; SMN2MEN1MAPTKDM4E
SCHEMBL15618159 0.81 SMN1; SMN2 (0.52) KMT2ASMN1; SMN2MEN1MAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 187 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US claimed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US claimed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP claimed
US-11078358-B2 Curable composition including epoxy resin and curable solid filler 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-08-03 US claimed
EP-3814398-A1 CURABLE COMPOSITIONS AND RELATED METHODS 3M Innovative Properties Company (US) 2021-05-05 EP claimed
US-20210102061-A1 CURABLE COMPOSITIONS AND RELATED METHODS 3M INNOVATIVE PROPERTIES COMPANY 2021-04-08 US claimed
EP-3466680-B1 PLASTIC LAMINATE FILM LG CHEMICAL LTD (KR) 2021-02-17 EP claimed
WO-2020128780-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES COMPANY (US) 2020-06-25 WO claimed
EP-3661990-A1 CURABLE COMPOSITION INCLUDING EPOXY RESIN AND CURABLE SOLID FILLER 3M Innovative Properties Company (US) 2020-06-10 EP claimed
US-20200148878-A1 CURABLE COMPOSITION INCLUDING EPOXY RESIN AND CURABLE SOLID FILLER 3M INNOVATIVE PROPERTIES COMPANY 2020-05-14 US claimed
US-6313233-B1 CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-11-06 US claimed
EP-1024407-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION PI R & D Co Ltd (JP) 2000-08-02 EP claimed
US-5541000-A Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-07-30 US claimed
EP-0719293-A1 LATENT, THERMAL CURE ACCELERATORS FOR EPOXY-AROMATIC AMINE RESINS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-07-03 EP claimed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US claimed
WO-1995005411-A2 LATENT, THERMAL CURE ACCELERATORS FOR EPOXY-AROMATIC AMINE RESINS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-02-23 WO claimed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US claimed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP claimed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US claimed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP claimed