Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 3/20 | 0.39 |
| ▸ | CA6 | P23280 | 3/20 | 0.39 |
| ▸ | CA7 | P43166 | 3/20 | 0.39 |
| ▸ | CA9 | Q16790 | 3/20 | 0.39 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.39 |
| ▸ | CA5B | Q9Y2D0 | 3/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | RECQL | P46063 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.38 |
| ▸ | CA2 | P00918 | 2/20 | 0.38 |
| ▸ | CA3 | P07451 | 2/20 | 0.38 |
| ▸ | CA4 | P22748 | 2/20 | 0.38 |
| ▸ | CA5A | P35218 | 2/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | TP53 | P04637 | 1/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL56116 | 0.80 | TSHR (0.42) | ALDH1A1 | |
| SCHEMBL56585 | 0.79 | — | — | |
| SCHEMBL40404 | 0.78 | CA12 (0.44) | CA12CA6CA7CA9CA14 | |
| SCHEMBL11036494 | 0.77 | CA12 (0.42) | CA12CA6CA7CA9CA14 | |
| SCHEMBL5682045 | 0.77 | TSHR (0.46) | LMNAALDH1A1 | |
| SCHEMBL6444276 | 0.75 | CA12 (0.41) | CA12CA6CA7CA9CA14 | |
| Ammonia Solution, Strong SCHEMBL22712951 | 0.75 | CA12 (0.41) | CA12CA6CA7CA9CA14 | |
| SCHEMBL57589 | 0.73 | TP53 (0.35) | TP53 | |
| SCHEMBL2464400 | 0.72 | CA12 (0.31) | CA12CA6CA7CA9CA14 | |
| SCHEMBL57611 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3401366-B1 | SILICONE COMPOSITION BASED ON BOTH CONDENSATION CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION | SHINETSU CHEMICAL CO (JP) | 2020-08-26 | — | — | EP | disclosed |
| US-10689515-B2 | Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-06-23 | — | — | US | disclosed |
| US-20190010294-A1 | SILICONE COMPOSITION BASED ON BOTH CONDENSATION/CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-01-10 | — | — | US | disclosed |
| EP-3401366-A1 | SILICONE COMPOSITION BASED ON BOTH CONDENSATION/CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-11-14 | — | — | EP | disclosed |
| US-9238734-B2 | Room temperature and humidity thickening thermo-conductive silicon grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-01-19 | — | — | US | disclosed |
| EP-2743315-A1 | ROOM TEMPERATURE AND HUMIDITY THICKENING THERMO-CONDUCTIVE SILICON GREASE COMPOSITION | Shin-Etsu Chemical Co., Ltd. (JP) | 2014-06-18 | — | — | EP | disclosed |
| US-8658754-B2 | Moisture-thickening heat-conductive silicone grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-25 | — | — | US | disclosed |
| EP-2439241-B1 | Moisture-thickening heat-conductive silicone grease composition | SHINETSU CHEMICAL CO (JP) | 2013-04-03 | — | — | EP | disclosed |
| US-20120085964-A1 | MOISTURE-THICKENING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-04-12 | — | — | US | disclosed |
| US-8153747-B2 | Two-part organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-04-10 | — | — | US | disclosed |
| US-20110034613-A1 | TWO-PART ORGANOPOLYSILOXANE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-10 | — | — | US | disclosed |
| EP-1191066-B1 | Room temperature-curing organopolysiloxane composition | SHINETSU CHEMICAL CO (JP) | 2005-11-09 | — | — | EP | disclosed |
| US-6573356-B2 | Used for building construction or used in the bonding or fixing of electric or electronic component parts | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2003-06-03 | — | — | US | disclosed |
| US-20020065385-A1 | Room temperature-curing organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-30 | — | — | US | disclosed |
| EP-1191066-A2 | Room temperature-curing organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-03-27 | — | — | EP | disclosed |