SCHEMBL56585

SCHEMBL56585

CCCNCC([SiH3])(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL56116 0.86 TSHR (0.42)
SCHEMBL5682045 0.83 TSHR (0.46)
SCHEMBL57589 0.80 TP53 (0.35)
SCHEMBL1095064 0.79 CA12 (0.39)
SCHEMBL25978229 0.73 ALDH1A1 (0.43)
SCHEMBL2385119 0.69 TSHR (0.34)
SCHEMBL57192 0.69
SCHEMBL234890 0.68
SCHEMBL2388007 0.67 TSHR (0.42)
SCHEMBL21496058 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 129 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260125587-A1 PROCESS FOR PRODUCING A STORAGE-STABLE ACTIVATOR FOR GLASS AND CERAMIC SUBSTRATES SIKA TECHNOLOGY AG (CH) 2026-05-07 US disclosed
US-12391853-B2 Adhesive formulations for roofing applications and related methods BMIC LLC (US) 2025-08-19 US disclosed
US-20250206871-A1 COATING PRIMER HAVING GOOD APPLICABILITY AT LOW TEMPERATURES SIKA TECHNOLOGY AG (CH) 2025-06-26 US disclosed
EP-4574865-A1 COATING PRIMER HAVING GOOD APPLICABILITY AT LOW TEMPERATURES Sika Technology AG (CH) 2025-06-25 EP disclosed
US-20250019547-A1 PROCESS FOR PRODUCING A STORAGE-STABLE AQUEOUS PRIMER FOR GLASS AND CERAMIC SUBSTRATES SIKA TECHNOLOGY AG (CH) 2025-01-16 US disclosed
EP-4219641-B1 AQUEOUS PRETREATMENT FOR BONDS WITH AN ENHANCED HEAT STABILITY SIKA TECH AG (CH) 2024-09-04 EP disclosed
WO-2024052071-A1 PROCESS FOR PRODUCING A STORAGE-STABLE ACTIVATOR FOR GLASS AND CERAMIC SUBSTRATES SIKA TECHNOLOGY AG (CH) 2024-03-14 WO disclosed
US-11920038-B2 Method for manufacturing processed cork chip and method for constructing floor using same A-ROAD CO. (KR) 2024-03-05 US disclosed
US-20230313006-A1 PRIMER FOR POLYURETHANE ADHESIVE DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) 2023-10-05 US disclosed
US-20230313005-A1 ADHESIVE FORMULATIONS FOR ROOFING APPLICATIONS AND RELATED METHODS BMIC LLC (US) 2023-10-05 US disclosed
EP-1894966-A1 Aqueous primer composition comprising aminosilane and mercaptosilane Sika Technology AG (CH) 2008-03-05 EP disclosed
EP-1877459-A2 MOISTURE-CURABLE COMPOSITION FEATURING INCREASED ELASTICITY SIKA TECHNOLOGY AG (CH) 2008-01-16 EP disclosed
US-20070190345-A1 Aqueous two-component organoalkoxysilane composition SIKA TECHNOLOGY AG (CH) 2007-08-16 US disclosed
WO-2007057441-A1 MIXING DEVICE FOR LIQUIDS SIKA TECHNOLOGY AG (CH) 2007-05-24 WO disclosed
EP-1787712-A1 Mixing device for liquids Sika Technology AG (CH) 2007-05-23 EP disclosed
WO-2007026015-A1 SURFACTANT-STABILIZED ORGANOALKOXYSILANE COMPOSITION SIKA TECHNOLOGY AG (CH) 2007-03-08 WO disclosed
EP-1760084-A1 Tenside stabilized organoalkoxysilane composition Sika Technology AG (CH) 2007-03-07 EP disclosed
EP-1760128-A1 Two-component aqueous organoalkoxysilane composition Sika Technology AG (CH) 2007-03-07 EP disclosed
WO-2006117338-A2 MOISTURE-CURABLE COMPOSITION FEATURING INCREASED ELASTICITY SIKA TECHNOLOGY AG (CH) 2006-11-09 WO disclosed
EP-1717254-A1 Moisture-curable composition with improved elongation Sika Technology AG (CH) 2006-11-02 EP disclosed