SCHEMBL1100568

SCHEMBL1100568

Cc1cc(C(C)(C)C)c(C(O)COP(O)O)c(C(C)(C)C)c1

nearest known ligand 0.40

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.40
ALDH1A1 P00352 1/20 0.40
CA2 P00918 1/20 0.40
POLB P06746 1/20 0.40
TYR P14679 1/20 0.40
HSPA5 P11021 1/20 0.38
CYP2C9 P11712 2/20 0.37
CYP2C19 P33261 2/20 0.37
HIF1A Q16665 2/20 0.37
USP2 O75604 1/20 0.34
CYP2D6 P10635 1/20 0.33
HSD17B10 Q99714 1/20 0.33
MEN1 O00255 1/20 0.31
LMNA P02545 1/20 0.31
KMT2A Q03164 1/20 0.31
MAPT P10636 2/20 0.31
GLA P06280 1/20 0.31
TP53 P04637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1100185 0.84 SMN1; SMN2 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1101462 0.83 SMN1; SMN2 (0.37) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1101361 0.82 CA2 (0.38) SMN1; SMN2ALDH1A1CA2MEN1KMT2A
SCHEMBL2264850 0.81 SMN1; SMN2 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1100570 0.78 SMN1; SMN2 (0.44) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1100187 0.75 SMN1; SMN2 (0.41) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1101463 0.74 SMN1; SMN2 (0.40) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL39015 0.72 ALDH1A1 (0.35) ALDH1A1POLBCYP2C9CYP2C19CYP2D6
SCHEMBL29421164 0.72 ALDH1A1 (0.35) ALDH1A1POLBCYP2C9CYP2C19CYP2D6
SCHEMBL29371138 0.72 SMN1; SMN2 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2740590-B1 PANEL AND PANEL INSTALLATION STRUCTURE MITSUBISHI ENG PLASTICS CORP (JP) 2021-03-31 EP disclosed
EP-2740590-A1 PANEL AND PANEL INSTALLATION STRUCTURE Mitsubishi Engineering-Plastics Corporation (JP) 2014-06-11 EP disclosed
US-8153239-B2 Polycarbonate resin composition and heat ray shielding molded product MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-04-10 US disclosed
US-20090136730-A1 Polycarbonate Resin Composition and Heat Ray Shielding Molded Product MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-05-28 US disclosed
US-5770644-A FIREPROOFING MOLDING MATERIAL BLENDS COMPRISING A POLYESTERS, A POLYPHENYLENE ETHER RESIN AND/OR POLYPHENYLENE SULFIDE RESIN AND A COMPATIBILIZING AGENT; NONHYDROLYSIS, FLEXIBILITY, DIMENSION STABILITY, CORROSION RESISTANCE MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 1998-06-23 US disclosed
EP-0791634-A2 Fire retardant polyester resin composition and process for producing the same Mitsubishi Engineering Plastics Corporation (JP) 1997-08-27 EP disclosed
EP-0765914-A1 POLYPHENYLENE ETHER RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 1997-04-02 EP disclosed