SCHEMBL1100787

SCHEMBL1100787

CC(C)(C)c1ccc(C(O)CCO)cc1.OP(O)O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.44
KCNH2 Q12809 2/20 0.44
MEN1 O00255 1/20 0.44
NPC1 O15118 1/20 0.44
CACNA1F O60840 1/20 0.44
GMNN O75496 1/20 0.44
USP2 O75604 1/20 0.44
EGFR P00533 1/20 0.44
CYP1A2 P05177 1/20 0.44
FYN P06241 1/20 0.44
CHRM2 P08172 1/20 0.44
ABCB1 P08183 1/20 0.44
CYP3A4 P08684 1/20 0.44
HTR1A P08908 1/20 0.44
ADRA2A P08913 1/20 0.44
ADORA3 P0DMS8 1/20 0.44
GAA P10253 1/20 0.44
CYP2D6 P10635 1/20 0.44
MAPT P10636 1/20 0.44
CHRM1 P11229 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3187891 0.94 LMNA (0.45) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL1100312 0.85 LMNA (0.47) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL6827541 0.85 LMNA (0.46) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL6055147 0.79 GRIA4 (0.45) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL1100390 0.79 ALDH1A1 (0.42) LMNAHTR1AGAAMAPTSLC6A2
SCHEMBL23188717 0.79 LMNA (0.51) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL31376561 0.79 LMNA (0.51) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL1629743 0.79 LMNA (0.51) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL1100785 0.78 LMNA (0.39) LMNAKCNH2MEN1NPC1CACNA1F
SCHEMBL6055419 0.78 LMNA (0.46) LMNAKCNH2MEN1NPC1CACNA1F

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2740590-B1 PANEL AND PANEL INSTALLATION STRUCTURE MITSUBISHI ENG PLASTICS CORP (JP) 2021-03-31 EP disclosed
EP-2740590-A1 PANEL AND PANEL INSTALLATION STRUCTURE Mitsubishi Engineering-Plastics Corporation (JP) 2014-06-11 EP disclosed
US-8153239-B2 Polycarbonate resin composition and heat ray shielding molded product MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-04-10 US disclosed
US-20090136730-A1 Polycarbonate Resin Composition and Heat Ray Shielding Molded Product MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-05-28 US disclosed
EP-0791634-B1 Fire retardant polyester resin composition and process for producing the same MITSUBISHI ENG PLASTICS CORP (JP) 2002-11-06 EP disclosed
US-5770644-A FIREPROOFING MOLDING MATERIAL BLENDS COMPRISING A POLYESTERS, A POLYPHENYLENE ETHER RESIN AND/OR POLYPHENYLENE SULFIDE RESIN AND A COMPATIBILIZING AGENT; NONHYDROLYSIS, FLEXIBILITY, DIMENSION STABILITY, CORROSION RESISTANCE MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 1998-06-23 US disclosed
EP-0791634-A2 Fire retardant polyester resin composition and process for producing the same Mitsubishi Engineering Plastics Corporation (JP) 1997-08-27 EP disclosed
EP-0765914-A1 POLYPHENYLENE ETHER RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 1997-04-02 EP disclosed