SCHEMBL1104781

SCHEMBL1104781

CC(C)(c1cc(Br)c(OCC2CO2)c(Br)c1)c1cc(Br)c(OCC2CO2)c(Br)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.55
TSHR P16473 5/20 0.55
TP53 P04637 3/20 0.55
HPGD P15428 3/20 0.55
HIF1A Q16665 3/20 0.55
MAPT P10636 2/20 0.55
MEN1 O00255 2/20 0.55
KMT2A Q03164 2/20 0.55
CYP1A2 P05177 1/20 0.55
PPARG P37231 1/20 0.55
GLA P06280 1/20 0.42
CYP3A4 P08684 2/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
TDP1 Q9NUW8 2/20 0.39
ALOX15 P16050 2/20 0.39
ALOX12 P18054 2/20 0.39
CASP1 P29466 1/20 0.39
RECQL P46063 1/20 0.39
HSD17B10 Q99714 1/20 0.39
MAPK1 P28482 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21846072 0.95 ALDH1A1 (0.51) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL16727406 0.94 ALDH1A1 (0.50) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL676692 0.94 ALDH1A1 (0.50) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL26869214 0.93 ALDH1A1 (0.49) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL943782 0.93 TSHR (0.53) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL12643938 0.93 TSHR (0.53) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL1262667 0.92 MEN1 (0.64) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL14212723 0.92 ALDH1A1 (0.48) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL19852380 0.92 ALDH1A1 (0.48) ALDH1A1TSHRTP53HPGDHIF1A
SCHEMBL16562605 0.91 ALDH1A1 (0.50) ALDH1A1TSHRTP53HPGDHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 531 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4724537-A1 COATING RESISTANT TO BIOGROWTH PARTICULARLY IN MARINE ENVIRONMENTS Core Industries II, LLC (US) 2026-04-15 EP claimed
EP-4720052-A1 CHROMOPHORE-FUNCTIONAL POLYOLS ARKEMA France (FR) 2026-04-08 EP claimed
CN-120118480-A Degradable epoxy resin composite material with adjustable curing speed and preparation and moderate full recycling methods thereof 哈尔滨工业大学 2025-06-10 CN claimed
CN-120041182-A Particle size-controllable epoxy resin fracturing propping agent and preparation method thereof 江苏扬农化工集团有限公司 2025-05-27 CN claimed
CN-119842046-A Low-viscosity liquefied dicyandiamide latent curing agent, epoxy resin composition, and preparation method and application thereof 中国石油化工股份有限公司 2025-04-18 CN claimed
CN-119752183-A Preparation method of epoxy resin fracturing propping agent with high heat resistance and low breakage rate 江苏扬农化工集团有限公司 2025-04-04 CN claimed
CN-114829468-B Prepreg, method for producing the prepreg and fiber-reinforced composite material produced from the prepreg 可隆工业株式会社 2025-04-01 CN claimed
CN-119463773-A Epoxy adhesive and preparation method and application thereof 韦尔通科技股份有限公司 2025-02-18 CN claimed
CN-119350271-A Preparation method of tetrabromobisphenol A diglycidyl ether 湖北安卡新材料科技有限公司 2025-01-24 CN claimed
US-20250019481-A1 THERMOPLASTIC MODACRYLIC RESIN AND THERMOPLASTIC MODACRYLIC RESIN COMPOSITION INCLUDING SAME KANEKA CORPORATION (JP) 2025-01-16 US claimed
EP-4053193-A1 PREPREG, PREPARATION METHOD THEREOF, AND FIBER REINFORCED COMPOSITE MATERIAL PREPARED THEREFROM Kolon Industries, Inc. (KR) 2022-09-07 EP claimed
CN-112673033-B Crosslinkable compositions with low viscosity for coatings and materials with high refractive index and high heat deflection temperature 阿科玛法国公司 2022-08-30 CN claimed
CN-114829468-A Prepreg, method for producing prepreg, and fiber-reinforced composite material produced from prepreg 可隆工业株式会社 2022-07-29 CN claimed
US-11352489-B2 Thermoplastic acrylic resin and method for producing same, and resin composition KANEKA CORPORATION (JP) 2022-06-07 US claimed
CN-114230767-A Imidazole derivative microcapsule type latent curing agent for adhesive and preparation method thereof 江苏钛得新材料技术有限公司 2022-03-25 CN claimed
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP claimed
EP-0441383-B1 Use of a copolymer for the making of contact lenses MITSUBISHI RAYON CO (JP) 1996-05-08 EP claimed
US-5357027-A Fireproof, heat resistant, impact resistant molding materials IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1994-10-18 US claimed
US-5183870-A A curable polybutylene glycol di(meth)acrylate, a urethane or epoxy (meth)acrylate and a (meth)acrylate; heat and water resistance; impact strength; dyeability; workability MITSUBISHI RAYON CO., LTD (JP) 1993-02-02 US claimed
EP-0441383-A2 Use of a copolymer for the making of contact lenses MITSUBISHI RAYON CO., LTD. (JP) 1991-08-14 EP claimed