SCHEMBL11048816

SCHEMBL11048816

CC1CCC(N)C1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8035647 0.83 DNM1 (0.36)
SCHEMBL12993494 0.82
SCHEMBL2610292 0.82
SCHEMBL7175341 0.82
SCHEMBL19739056 0.82
SCHEMBL4165773 0.82
SCHEMBL14607766 0.82
SCHEMBL15984784 0.82
SCHEMBL10794340 0.82 FUCA1 (0.30)
SCHEMBL17021841 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3770200-B1 EPOXY RESIN COMPOSITION FOR CHEMICAL-RESISTANT COATING APPLICATIONS SHERWIN WILLIAMS COATINGS DEUTSCHLAND GMBH (DE) 2022-12-28 EP disclosed
WO-2015013427-A1 METHOD FOR MAKING 2-METHYLPENTAMETHYLENEDIAMINE AND ADIPONITRILE WITH HOT AMMONIA SWEEP INVISTA TECHNOLOGIES S.À.R.L. (CH) 2015-01-29 WO disclosed
US-4467100-A Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures LORD CORPORATION (US) 1984-08-21 US disclosed
US-4366302-A HEAT RESISTANCE CURING AGENTS LORD CORPORATION (US) 1982-12-28 US disclosed
US-4340715-A Epoxy resin compositions cured with imide-amines LORD CORPORATION (US) 1982-07-20 US disclosed