SCHEMBL1109650

SCHEMBL1109650

CCOc1c2ccccc2c(OCC)c2cc(S(=O)(=O)OCc3ccc([N+](=O)[O-])cc3)ccc12

nearest known ligand 0.42

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA7 P43166 1/20 0.42
CA9 Q16790 1/20 0.42
CYP19A1 P11511 8/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
LMNA P02545 1/20 0.39
MAOB P27338 2/20 0.38
MAOA P21397 1/20 0.38
IDO1 P14902 2/20 0.38
HPGD P15428 1/20 0.38
RAB9A P51151 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31233774 1.00 MEN1 (0.42) MEN1KMT2ACA12CA1CA2
SCHEMBL9304464 0.91 MEN1 (0.41) MEN1KMT2ACA12CA1CA2
SCHEMBL12595121 0.90 MEN1 (0.42) MEN1KMT2ACA12CA1CA2
SCHEMBL30139585 0.89 HTT (0.44) MEN1KMT2ACA12CA1CA2
SCHEMBL335568 0.89 HTT (0.44) MEN1KMT2ACA12CA1CA2
SCHEMBL28177879 0.87 CA1 (0.40) MEN1KMT2ACA12CA1CA2
SCHEMBL13475516 0.84 MAOB (0.43) MEN1KMT2ACA12CA1CA2
SCHEMBL12595120 0.83 MEN1 (0.39) MEN1KMT2ACA12CA1CA2
SCHEMBL13367173 0.83 CA12 (0.38) MEN1KMT2ACA12CA1CA2
SCHEMBL4905251 0.82 MAOB (0.40) MEN1KMT2ACA12CA9LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0568993-B1 Chemical amplification resist composition KYOWA HAKKO KOGYO KK (JP) 1998-08-12 EP claimed
US-5527659-A PHOTOSENSITIVITY KYOWA HAKKO KOGYO CO., LTD. (JP) 1996-06-18 US claimed
US-4963463-A Radiation-sensitive resin composition with admixtures of O-quinone diazide and acid esters having nitrobenzyl or cyanobenzyl group JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-10-16 US claimed
EP-0330406-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1989-08-30 EP claimed
JP-5247386-A None JP disclosed
JP-4110348-A None JP disclosed
JP-4069662-A None JP disclosed
US-20250213434-A1 DENTAL CURABLE COMPOSITION HAVING FAVORABLE COLOR COMPATIBILITY KURARAY NORITAKE DENTAL INC. (JP) 2025-07-03 US disclosed
EP-4505992-A1 DENTAL CURABLE COMPOSITION HAVING FAVORABLE COLOR COMPATIBILITY Kuraray Noritake Dental Inc. (JP) 2025-02-12 EP disclosed
WO-2024075641-A1 POLYMER MATERIAL FOR USE IN DENTISTRY サンメディカル株式会社 2024-04-11 WO disclosed
WO-2023243636-A1 MEMBER PROCESSING METHOD 日東電工株式会社 2023-12-21 WO disclosed
WO-2023243634-A1 TRANSFER SHEET 日東電工株式会社 2023-12-21 WO disclosed
JP-H05247386-A POSITIVE-TYPE PHOTOSENSITIVE ANIONIC ELECTRODEPOSITION COATING RESIN COMPOSITION, COATING THEREFROM, BATH THEREFOR, COATING METHOD AND PRODUCTION OF PRINTED CIRCUIT BOARD HITACHI CHEM CO LTD 1993-09-24 JP disclosed
EP-0542485-A1 Radiation curable compositions Dow Corning Limited (GB) 1993-05-19 EP disclosed
JP-H04110348-A PHOTOSENSITIVE POLYIMIDE COMPOSITION AND ITS DEVELOPMENT UBE IND LTD 1992-04-10 JP disclosed
JP-H0469662-A RESIST PROCESSING METHOD JAPAN SYNTHETIC RUBBER CO LTD 1992-03-04 JP disclosed
US-4963463-A Radiation-sensitive resin composition with admixtures of O-quinone diazide and acid esters having nitrobenzyl or cyanobenzyl group JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-10-16 US disclosed
EP-0377175-A2 Pattern forming composition and process for forming pattern using the same HITACHI, LTD. (JP) 1990-07-11 EP disclosed
EP-0330406-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1989-08-30 EP disclosed
JP-H00469662-A 0001-01-01 JP disclosed