Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | CA12 | O43570 | 1/20 | 0.40 |
| ▸ | CA1 | P00915 | 1/20 | 0.40 |
| ▸ | CA2 | P00918 | 1/20 | 0.40 |
| ▸ | CA7 | P43166 | 1/20 | 0.40 |
| ▸ | CA9 | Q16790 | 1/20 | 0.40 |
| ▸ | HTR1A | P08908 | 1/20 | 0.40 |
| ▸ | ADRA1D | P25100 | 1/20 | 0.40 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.40 |
| ▸ | ADRA1B | P35368 | 1/20 | 0.40 |
| ▸ | CYP19A1 | P11511 | 10/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | MAOB | P27338 | 2/20 | 0.37 |
| ▸ | MAOA | P21397 | 1/20 | 0.37 |
| ▸ | IDO1 | P14902 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12595121 | 0.95 | MEN1 (0.42) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL1109650 | 0.91 | MEN1 (0.42) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL31233774 | 0.91 | MEN1 (0.42) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL335568 | 0.87 | HTT (0.44) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL30139585 | 0.87 | HTT (0.44) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL13367173 | 0.86 | CA12 (0.38) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL13475516 | 0.84 | MAOB (0.43) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL10403263 | 0.83 | MAPT (0.40) | MEN1KMT2ACA12CA9HTR1A | |
| SCHEMBL8075081 | 0.80 | S100A4 (0.45) | MEN1KMT2ACA12CA1CA2 | |
| SCHEMBL28177879 | 0.78 | CA1 (0.40) | MEN1KMT2ACA12CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4963463-A | Radiation-sensitive resin composition with admixtures of O-quinone diazide and acid esters having nitrobenzyl or cyanobenzyl group | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1990-10-16 | — | — | US | claimed |
| EP-0330406-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1989-08-30 | — | — | EP | claimed |
| EP-4146762-B1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE ON UNEVEN SURFACES | DOW SILICONES CORP (US) | 2024-05-08 | — | — | EP | disclosed |
| US-20240141210-A1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE ON UNEVEN SURFACES | DOW CHEMICAL SILICONES KOREA, LTD. (KR) | 2024-05-02 | — | — | US | disclosed |
| US-20230091861-A1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE IN PROTECTIVE FILMS FOR (OPTO)ELECTRONIC DEVICE FABRICATION | DOW CHEMICAL SILICONES KOREA, LTD. (KR) | 2023-03-23 | — | — | US | disclosed |
| EP-4146762-A1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE ON UNEVEN SURFACES | Dow Silicones Corporation (US) | 2023-03-15 | — | — | EP | disclosed |
| EP-4146761-A1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE IN PROTECTIVE FILMS FOR (OPTO)ELECTRONIC DEVICE FABRICATION | Dow Silicones Corporation (US) | 2023-03-15 | — | — | EP | disclosed |
| CN-115516056-A | Silicone hybrid pressure sensitive adhesive, method of making the same, and method of use in protective films for (opto) electronic device manufacture | 美国陶氏有机硅公司 | 2022-12-23 | — | — | CN | disclosed |
| CN-115485350-A | Silicone hybrid pressure sensitive adhesives, methods of making and use on non-uniform surfaces | 美国陶氏有机硅公司 | 2022-12-16 | — | — | CN | disclosed |
| WO-2021225675-A1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE ON UNEVEN SURFACES | DOW SILICONS CORPORATION (US) | 2021-11-11 | — | — | WO | disclosed |
| WO-2021225673-A1 | SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE IN PROTECTIVE FILMS FOR (OPTO)ELECTRONIC DEVICE FABRICATION | DOW SILICONES CORPORATION (US) | 2021-11-11 | — | — | WO | disclosed |
| US-20070138139-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, ACID ETCHING RESISTANCE MATERIAL AND COPOLYMER | ASAKAWA KOJI | 2007-06-21 | — | — | US | disclosed |
| US-20070138139-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, ACID ETCHING RESISTANCE MATERIAL AND COPOLYMER | ASAKAWA KOJI | 2007-06-21 | — | — | US | disclosed |
| US-20070101898-A1 | Inkjet ink | AKIYAMA RYOZO | 2007-05-10 | — | — | US | disclosed |
| US-20070101898-A1 | Inkjet ink | AKIYAMA RYOZO | 2007-05-10 | — | — | US | disclosed |
| US-7208334-B2 | Method of manufacturing semiconductor device, acid etching resistance material and copolymer | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-04-24 | — | — | US | disclosed |
| CN-1849355-A | Photosensitive resin composition and film having cured coat formed therefrom | NIPPON KAYAKU KK (JP) | 2006-10-18 | — | — | CN | disclosed |
| US-5279923-A | Generating an acid when exposured to actinic radiation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1994-01-18 | — | — | US | disclosed |
| US-4963463-A | Radiation-sensitive resin composition with admixtures of O-quinone diazide and acid esters having nitrobenzyl or cyanobenzyl group | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1990-10-16 | — | — | US | disclosed |
| EP-0330406-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1989-08-30 | — | — | EP | disclosed |