⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL226243 | 0.74 | KDM1A (0.32) | — | |
| SCHEMBL11316508 | 0.66 | NOS1 (0.32) | — | |
| SCHEMBL7025529 | 0.66 | — | — | |
| SCHEMBL486038 | 0.66 | KDM1A (0.37) | — | |
| SCHEMBL775780 | 0.63 | — | — | |
| SCHEMBL27577099 | 0.62 | MAPT (0.33) | — | |
| SCHEMBL61121 | 0.62 | — | — | |
| SCHEMBL1123913 | 0.61 | KDM1A (0.31) | — | |
| SCHEMBL1617400 | 0.59 | KDM1A (0.31) | — | |
| SCHEMBL1123940 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4632012-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE | Zeon Corporation (JP) | 2025-10-15 | — | — | EP | disclosed |
| WO-2024122426-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE | 日本ゼオン株式会社 | 2024-06-13 | — | — | WO | disclosed |
| US-20110130484-A1 | PROCESS FOR PRODUCING POLYMER ALLOY AND POLYMER ALLOY | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-06-02 | — | — | US | disclosed |
| EP-1473328-B1 | RESIN COMPOSITION | SEKISUI CHEMICAL CO LTD (JP) | 2011-05-04 | — | — | EP | disclosed |
| EP-2284212-A1 | PROCESS FOR PRODUCING POLYMER ALLOY AND POLYMER ALLOY | Sekisui Chemical Co., Ltd. (JP) | 2011-02-16 | — | — | EP | disclosed |
| US-7754803-B2 | Resin composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-07-13 | — | — | US | disclosed |
| US-20090256283-A1 | THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE | SEKISUI CHEMICAL CO., LTD. | 2009-10-15 | — | — | US | disclosed |
| US-20080268237-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20080268257-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYMIDE FILM, FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20070072963-A1 | Thermoplastic resin composition, material for substrate and film for substrate | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-03-29 | — | — | US | disclosed |
| EP-1331245-B1 | MELT-MOLDABLE THERMOPLASTIC NORBORNENE RESIN COMPOSITION AND MOLDED ARTICLE AND OPTICAL FILM BOTH COMPRISING THE SAME | SEKISUI CHEMICAL CO LTD (JP) | 2006-03-29 | — | — | EP | disclosed |
| US-7015276-B2 | A blends comprising a polynorbornene and an addition polymer for lowing glass transition temperature; improving moldability, moisture permeability and adhesiveness | SEKISUI CHEMICAL CO., LTD. (JP) | 2006-03-21 | — | — | US | disclosed |
| US-20050165151-A1 | thermoplastic resins, substrates, sheet, laminated boards, resin-bearing copper foils, copper-clad laminates, tapes, printed circuits, prepregs and adhesive sheets, having dimensional stability, heat resistance and flame retardance | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20050020806-A1 | Method for producing polymer alloy polymer alloy formed article transparent formed article and optical film | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| EP-1473328-A1 | RESIN COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-11-03 | — | — | EP | disclosed |
| EP-1445274-A1 | METHOD FOR PRODUCING POLYMER ALLOY, POLYMER ALLOY, FORMED ARTICLE, TRANSPARENT FORMED ARTICLE AND OPTICAL FILM | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-08-11 | — | — | EP | disclosed |
| US-20040053061-A1 | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-03-18 | — | — | US | disclosed |
| US-20040039122-A1 | Melt-moldable thermoplastic norbornene resin composition and molded article and optical film both comprising the same | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-02-26 | — | — | US | disclosed |
| EP-1350815-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM, FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2003-10-08 | — | — | EP | disclosed |
| EP-1331245-A1 | MELT-MOLDABLE THERMOPLASTIC NORBORNENE RESIN COMPOSITION AND MOLDED ARTICLE AND OPTICAL FILM BOTH COMPRISING THE SAME | SEKISUI CHEMICAL CO., LTD. (JP) | 2003-07-30 | — | — | EP | disclosed |