SCHEMBL1123940

SCHEMBL1123940

C1=C2C3CC3C3CC3C2CC2CCCCC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1123795 0.73
SCHEMBL4474066 0.60
SCHEMBL5465232 0.59 ALDH1A1 (0.41)
SCHEMBL18145177 0.57 ALDH1A1 (0.39)
SCHEMBL551724 0.57 ALDH1A1 (0.39)
SCHEMBL22562098 0.57 ALDH1A1 (0.33)
SCHEMBL8027649 0.54 ALDH1A1 (0.30)
SCHEMBL1408600 0.54 ALDH1A1 (0.33)
SCHEMBL6703968 0.53 HSD11B1 (0.37)
SCHEMBL22387333 0.51

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
WO-2024122426-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE 日本ゼオン株式会社 2024-06-13 WO disclosed
US-20110130484-A1 PROCESS FOR PRODUCING POLYMER ALLOY AND POLYMER ALLOY SEKISUI CHEMICAL CO., LTD. (JP) 2011-06-02 US disclosed
EP-2284212-A1 PROCESS FOR PRODUCING POLYMER ALLOY AND POLYMER ALLOY Sekisui Chemical Co., Ltd. (JP) 2011-02-16 EP disclosed
US-20090256283-A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. 2009-10-15 US disclosed
US-20080268257-A1 MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYMIDE FILM, FILM FOR TAB, AND PREPREG SEKISUI CHEMICAL CO., LTD. (JP) 2008-10-30 US disclosed
US-20080268237-A1 MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM FOR TAB, AND PREPREG SEKISUI CHEMICAL CO., LTD. (JP) 2008-10-30 US disclosed
US-20070072963-A1 Thermoplastic resin composition, material for substrate and film for substrate SEKISUI CHEMICAL CO., LTD. (JP) 2007-03-29 US disclosed
US-7129322-B2 Method for producing polymer alloy polymer alloy formed article transparent formed article and optical film SEIKISUI CHEMICALS CO., LTD. (JP) 2006-10-31 US disclosed
EP-1696003-A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE SEKISUI CHEMICAL CO., LTD. (JP) 2006-08-30 EP disclosed
US-7015276-B2 A blends comprising a polynorbornene and an addition polymer for lowing glass transition temperature; improving moldability, moisture permeability and adhesiveness SEKISUI CHEMICAL CO., LTD. (JP) 2006-03-21 US disclosed
US-20050020806-A1 Method for producing polymer alloy polymer alloy formed article transparent formed article and optical film SEKISUI CHEMICAL CO., LTD. (JP) 2005-01-27 US disclosed
EP-1445274-A1 METHOD FOR PRODUCING POLYMER ALLOY, POLYMER ALLOY, FORMED ARTICLE, TRANSPARENT FORMED ARTICLE AND OPTICAL FILM SEKISUI CHEMICAL CO., LTD. (JP) 2004-08-11 EP disclosed
US-20040053061-A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg SEKISUI CHEMICAL CO., LTD. (JP) 2004-03-18 US disclosed
US-20040039122-A1 Melt-moldable thermoplastic norbornene resin composition and molded article and optical film both comprising the same SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1350815-A1 MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM, FILM FOR TAB, AND PREPREG SEKISUI CHEMICAL CO., LTD. (JP) 2003-10-08 EP disclosed
EP-1331245-A1 MELT-MOLDABLE THERMOPLASTIC NORBORNENE RESIN COMPOSITION AND MOLDED ARTICLE AND OPTICAL FILM BOTH COMPRISING THE SAME SEKISUI CHEMICAL CO., LTD. (JP) 2003-07-30 EP disclosed
EP-0498564-B1 Thermoplastic saturated norbornene group polymer composition NIPPON ZEON CO (JP) 1998-04-08 EP disclosed
US-5276098-A Thermoplastic saturated norbornene group polymer composition NIPPON ZEON CO., LTD. (JP) 1994-01-04 US disclosed
EP-0498564-A2 Thermoplastic saturated norbornene group polymer composition NIPPON ZEON CO., LTD. (JP) 1992-08-12 EP disclosed